是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | TSSOP, TSSOP24,.3 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.67 | Samacsys Confidence: | 4 |
Samacsys Status: | Released | Samacsys PartID: | 1812338 |
Samacsys Pin Count: | 24 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | Small Outline Packages | Samacsys Footprint Name: | SSOP-B24* |
Samacsys Released Date: | 2020-05-05 16:23:08 | Is Samacsys: | N |
JESD-30 代码: | R-PDSO-G24 | 端子数量: | 24 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TSSOP |
封装等效代码: | TSSOP24,.3 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 电源: | 5 V |
认证状态: | Not Qualified | 子类别: | Other Telecom ICs |
最大压摆率: | 28 mA | 标称供电电压: | 5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子形式: | GULL WING | 端子节距: | 0.635 mm |
端子位置: | DUAL | Base Number Matches: | 1 |
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