是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | FBGA, BGA32,6X6,16 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.7 | JESD-30 代码: | S-PBGA-B32 |
端子数量: | 32 | 最高工作温度: | 85 °C |
最低工作温度: | -20 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA32,6X6,16 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, FINE PITCH |
电源: | 1.8,3 V | 认证状态: | Not Qualified |
子类别: | Other Telecom ICs | 最大压摆率: | 28 mA |
表面贴装: | YES | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
BH143 | ADAM-TECH | BATTERY HOLDERS & SNAPS AA, AAA, C, D & COIN CELL |
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BH-14-3 | ADAM-TECH | BATTERY HOLDERS AAA, D SINGLE & MULTIPLE CELLS |
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BH143331F | TTELEC | High Profile SIP Thick Film Conformal Coated Resistor Networks |
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BH143331J | TTELEC | High Profile SIP Thick Film Conformal Coated Resistor Networks |
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BH143471F | TTELEC | High Profile SIP Thick Film Conformal Coated Resistor Networks |
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BH143471J | TTELEC | High Profile SIP Thick Film Conformal Coated Resistor Networks |
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