Datasheet > BGSA143GL10

BGSA143GL10

更新时间： 2023-09-03 20:28:26

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英飞凌 - INFINEON		/
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16页	777K
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天线相关器件

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BGSA143GL10 数据手册

BGSA143GL10

Low Resistance Antenna Tuning Switch

Maximum Ratings

2 Maximum Ratings

Table 1: Maximum Ratings, Table I at T_A= 25 ^◦C, unless otherwise specified

Parameter

Symbol

Values

Unit

Note / Test Condition

Min.

0.4

Typ.

–

Max.

–

Frequency Range

Supply voltage ²⁾

GHz

V_DD

-0.5

6.0

Only for infrequent and short

duration time periods

–

Storage temperature range

RF input power

T_STG

-55

–

150

^◦C

P_{RF_max}

dBm

Pulsed RF input power, duty

cycle of 25 % with T_period=

4620

Fig. 2

s, ON-state, setup as of

RF peak voltage

V_{RF_max}

–

Short term peaks (1

s, duty cy-

cle 0.1%), Isolation mode, test

setup acc. Fig. 1 and exceeding

typical linearity, R_ONand C_OFF

parameters

ESD capability, CDM ²⁾

V_ESD

-1

–

CDM

ESD capability, HBM ³⁾

V_ESD

-0.6

-8

+0.6

HBM

ESD capability, system level (RF port) ⁵⁾

V_ESD

RFx vs system GND, with 27 nH

ANT

shunt inductor on tested port

Junction temperature

T_j

–

125

^◦C

K/W

–

Thermal resistance junction - soldering point R_thJS

Control Voltage Levels V_Ctrl

–

-0.7

V_Ctrl+0.7

(max.

3.6)

¹⁾Switch has a low-pass response. For higher frequencies, losses have to be considered for their impact on thermal heating. The DC voltage at RF ports V_RFDChas

to be 0V.

²⁾Note: Consider any ripple voltages on top of V_IO. A high RF ripple at the V_IOcan exceed the maximum ratings by V_Ctrl= V_DC+ V_Ripple

³⁾Field-Induced Charged-Device Model ANSI/ESDA/JEDEC JS-002 Simulates charging/discharging events that occur in production equipment and processes.

Potential for CDM ESD events occurs whenever there is metal-to-metal contact in manufacturing.

⁴⁾Human Body Model ANSI/ESDA/JEDEC JS-001 (R = 1,5 kΩ, C = 100 pF).

⁵⁾IEC 61000-4-2 (R = 330 Ω, C = 150 pF), contact discharge.

Warning: Stresses above the max. values listed here may cause permanent damage to the device. Maximum ratings

are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Expo-

sure to conditions at or below absolute maximum rating but above the specified maximum operation conditions may

aꢀect device reliability and life time. Functionality of the device might not be given under these conditions.

Final Data Sheet

Revision 2.1

2021-06-23

1 2 345 6 7...16

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