是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | TSNP-10 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 12 weeks | 风险等级: | 1.63 |
Samacsys Confidence: | 4 | Samacsys Status: | Released |
Schematic Symbol: | https://componentsearchengine.com/symbol.php?partID=1310419 | PCB Footprint: | https://componentsearchengine.com/footprint.php?partID=1310419 |
Samacsys PartID: | 1310419 | Samacsys Image: | https://componentsearchengine.com/Images/9/BGSA12GN10E6327XTSA1.jpg |
Samacsys Thumbnail Image: | https://componentsearchengine.com/Thumbnails/1/BGSA12GN10E6327XTSA1.jpg | Samacsys Pin Count: | 10 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Other |
Samacsys Footprint Name: | PG-TSNP-10-1 | Samacsys Released Date: | 2018-07-03 16:48:39 |
Is Samacsys: | N | JESD-30 代码: | R-XBCC-B10 |
长度: | 1.5 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 10 |
最高工作温度: | 85 °C | 最低工作温度: | -30 °C |
封装主体材料: | UNSPECIFIED | 封装代码: | BCC |
封装形状: | RECTANGULAR | 封装形式: | CHIP CARRIER |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 0.4 mm |
标称供电电压: | 2.85 V | 表面贴装: | YES |
电信集成电路类型: | TELECOM CIRCUIT | 温度等级: | OTHER |
端子形式: | BUTT | 端子节距: | 0.4 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 1.1 mm | Base Number Matches: | 1 |
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