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BGS8358

更新时间: 2024-02-22 21:47:06
品牌 Logo 应用领域
恩智浦 - NXP 局域网无线电信电信集成电路
页数 文件大小 规格书
11页 163K
描述
Wireless LAN Circuit

BGS8358 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknown风险等级:5.81
电信集成电路类型:WIRELESS LAN CIRCUITBase Number Matches:1

BGS8358 数据手册

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BGS8358  
NXP Semiconductors  
WLAN LNA + Switch  
Table 4.  
Pin description …continued  
Symbol  
VTX  
Pin  
Description  
6
transmit mode control  
ground  
GND  
TX  
7, exposed die pad  
8
transmit input  
9. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VCC  
Parameter  
Conditions  
Min  
0.3  
-
Max  
6
Unit  
V
supply voltage  
ICC  
supply current  
worst case up to P1dB  
see Figure 1  
21  
mA  
V
VI(VRX)  
VI(VTX)  
input voltage on pin VRX  
input voltage on pin VTX  
0.3  
0.3  
0.3  
-
4
see Figure 1  
4
V
VI(LNA_EN) input voltage on pin LNA_EN  
4
V
Pi(ANT)  
input power-on pin ANT  
high gain receive mode  
bypass receive mode  
CW; transmit mode  
7
dBm  
dBm  
dBm  
°C  
°C  
°C  
V
-
19  
Pi(TX)  
Tamb  
Tstg  
input power-on pin TX  
ambient temperature  
storage temperature  
-
33  
40  
40  
40  
+85  
+150  
+150  
2000  
500  
Tj  
junction temperature  
[1]  
VESD  
electrostatic discharge voltage  
human body model  
-
[2]  
charged device model  
-
V
[1] According to ANSI/ESDA/JEDEC standard JS-001.  
[2] According to JEDEC standard JESD22-C101.  
10. Recommended operating conditions  
Table 6.  
Symbol  
f
Recommended operating conditions  
Parameter  
Conditions  
Min  
4900  
2.7  
1.8  
0
Typ  
Max  
Unit  
MHz  
V
frequency  
-
5925  
5.25  
3.6  
VCC  
supply voltage  
3.3  
[1]  
VIH  
HIGH-level input voltage  
LOW-level input voltage  
-
-
V
VIL  
+0.4  
V
[1] VIH is the result of an input voltage on that specific pin between 1.8 V and VCC 0.2 V and 3.6 V maximum.  
11. Thermal characteristics  
Table 7.  
Thermal characteristics  
Symbol Parameter  
Conditions  
Typ  
250  
Unit  
Rth(j-a)  
thermal resistance from junction to ambient  
K/W  
BGS8358  
All information provided in this document is subject to legal disclaimers.  
© NXP Semiconductors N.V. 2016. All rights reserved.  
Product data sheet  
Rev. 3 — 15 December 2016  
4 of 11  

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