Datasheet > BGA7130,118

BGA7130,118

更新时间： 2024-01-29 09:28:37

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
27页	853K
描述
BGA7130 - 400 MHz to 2700 MHz 1 W high linearity silicon amplifier SON 8-Pin

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BGA7130,118 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	SON	针数：	8
Reach Compliance Code：	compliant	风险等级：	7.98
Base Number Matches：	1

BGA7130,118 数据手册

BGA7130

NXP Semiconductors

400 MHz to 2700 MHz 1 W high linearity silicon amplifier

Table 1.

Quick reference data …continued

4.75 V  V_SUP 5.25 V; 40 C  T_case +85 C; P_i< 20 dBm; R3 = 523  (tolerance 1 %); input and output impedances

matched to 50  (see Section 14); pin ENABLE = HIGH; unless otherwise specified.

Symbol Parameter

T_casecase temperature

f frequency

Measured at LTE-750 MHz (see Section 14)

Conditions

Min Typ Max Unit

[3]

40 +25 +85 C

400

2700 MHz

[4]

frequency

728 748 768 MHz

G_p

power gain

728 MHz  f  768 MHz

P_L(1dB)output power at 1 dB gain compression 728 MHz  f  768 MHz

30.5

42.5

dBm

IP3_O

output third-order intercept point

728 MHz  f  768 MHz;

P_L= 19 dBm per tone;

tone spacing = 1 MHz

Measured at UMTS-2140 MHz (see Section 14)

[5]

frequency

2110 2140 2170 MHz

G_p

power gain

2110 MHz  f  2170 MHz

P_L(1dB)output power at 1 dB gain compression 2110 MHz  f  2170 MHz

dBm

IP3_O

output third-order intercept point

2110 MHz  f  2170 MHz;

P_L= 19 dBm per tone;

tone spacing = 1 MHz

40.5 44

[1] Supply voltage on pins RF_OUT and V_CC

[2] Current through pins RF_OUT and V_CC

[3] T_caseis the temperature at the soldering point of the exposed die pad.

[4] Covering downlink frequency range of eUTRAN bands 11, 13, 14 and 17.

[5] Covering downlink frequency range of eUTRAN bands 1, 4 and 10.

5. Design support

Table 2.

Available design support

Download from the BGA7130 product page on http://www.nxp.com.

Support item

Available

Remarks

[1]

Device models for Agilent EEsof EDA ADS planned

Device models for AWR Microwave Office no

Device models for ANSYS Ansoft designer no

Based on Mextram device model.

SPICE model

planned

yes

Based on Gummel-Poon device model.

S-parameters

Noise parameters

Customer evaluation kit

Gerber files

yes

See Section 6 and Section 14.

yes

Gerber files of boards provided with the customer evaluation kit.

Solder pattern

yes

[1] See http://www.nxp.com/models.html.

BGA7130

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 1 — 9 October 2012

2 of 27

123 4 5 6 7...27

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