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BD675_08 PDF预览

BD675_08

更新时间: 2024-09-25 12:50:11
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 109K
描述
Plastic MediumㅡPower Silicon NPN Darlingtons

BD675_08 数据手册

 浏览型号BD675_08的Datasheet PDF文件第2页浏览型号BD675_08的Datasheet PDF文件第3页浏览型号BD675_08的Datasheet PDF文件第4页 
BD675, BD675A, BD677,  
BD677A, BD679, BD679A,  
BD681  
BD681 is a Preferred Device  
Plastic Medium-Power  
Silicon NPN Darlingtons  
http://onsemi.com  
This series of plastic, mediumpower silicon NPN Darlington  
transistors can be used as output devices in complementary  
generalpurpose amplifier applications.  
4.0 AMPERES  
POWER TRANSISTORS  
NPN SILICON  
Features  
High DC Current Gain:  
60, 80, 100 VOLTS, 40 WATTS  
h
FE  
= 750 (Min) @ I  
C
= 1.5 and 2.0 Adc  
Monolithic Construction  
COLLECTOR 2  
BD675, 675A, 677, 677A, 679, 679A, 681 are complementary  
with BD676, 676A, 678, 678A, 680, 680A, 682  
BD677, 677A, 679, 679A are equivalent to MJE 800, 801, 802, 803  
PbFree Packages are Available*  
BASE  
3
EMITTER 1  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
CollectorEmitter Voltage BD675, A  
V
V
V
45  
60  
Vdc  
CEO  
CBO  
EBO  
BD677, A  
BD679, A  
BD681  
TO225AA  
CASE 77  
STYLE 1  
80  
100  
CollectorBase Voltage  
BD675, A  
BD677, A  
BD679, A  
BD681  
45  
60  
80  
100  
Vdc  
3
2
1
EmitterBase Voltage  
Collector Current  
Base Current  
5.0  
4.0  
1.0  
Vdc  
Adc  
Adc  
MARKING DIAGRAMS  
I
C
YWW  
B
I
B
YWW  
BD6xxG  
BD6xxAG  
Total Device Dissipation @ T = 25°C  
P
D
40  
0.32  
W
W/°C  
C
Derate above 25°C  
Operating and Storage Junction  
Temperature Range  
T , T  
55 to +150  
°C  
J
stg  
BD6xx = Device Code  
x = 75, 77, 79, 81  
THERMAL CHARACTERISTICS  
Characteristic  
Y
= Year  
Symbol  
Max  
Unit  
WW  
G
= Work Week  
= PbFree Package  
Thermal Resistance,  
q
3.13  
°C/W  
JC  
JunctiontoCase  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
Preferred devices are recommended choices for future use  
and best overall value.  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
September, 2008 Rev. 13  
BD675/D  

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