是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOP, | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.68 |
内置保护: | OVER CURRENT; THERMAL; UNDER VOLTAGE | 接口集成电路类型: | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e2 |
长度: | 4.9 mm | 功能数量: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 输出电流流向: | SINK |
标称输出峰值电流: | 1 A | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 最大供电电压: | 5.5 V |
最小供电电压: | 2.7 V | 标称供电电压: | 5 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Copper (Sn/Cu) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 断开时间: | 40 µs |
接通时间: | 20000 µs | 宽度: | 3.9 mm |
Base Number Matches: | 1 |
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