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BCM3814B60E15A3C02

更新时间： 2024-11-30 15:40:11
品牌 Logo 应用领域
VICOR 输入元件输出元件
页数 文件大小 规格书
41页 3760K
描述
DC-DC Unregulated Power Supply Module, 1 Output, 38W, Hybrid, MODULE-13

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中文翻译

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BCM3814B60E15A3C02 技术参数

是否Rohs认证： 符合生命周期：Active
包装说明：MODULE-13Reach Compliance Code：compliant
风险等级：5.74模拟集成电路 - 其他类型：DC-DC UNREGULATED POWER SUPPLY MODULE
认证：CE, TUV, UL效率（主输出）：97%
高度：9.4 mm最大输入电压：60 V
最小输入电压：36 V标称输入电压：54 V
JESD-30 代码：R-XXMA-T13长度：97.8 mm
功能数量：1输出次数：1
端子数量：13最高工作温度：125 °C
最低工作温度：-20 °C最大输出电流：130 A
最大输出电压：15 V最小输出电压：9 V
标称输出电压：13.5 V封装代码：XMA
封装等效代码：MODULE(UNSPEC)封装形状：RECTANGULAR
封装形式：MICROELECTRONIC ASSEMBLY保护：THERMAL; CURRENT; OUTPUT OVER VOLTAGE; INPUT OVER VOLTAGE
纹波电压（主输出）：0.0884 Vrms座面最大高度：9.781 mm
标称供电电压 (Vsup)：5 V表面贴装：NO
最大切换频率：1000 kHz技术：HYBRID
温度等级：INDUSTRIAL端子形式：THROUGH-HOLE
端子位置：DUAL最大总功率输出：38 W
微调/可调输出：NO热身时间：0.02 s
宽度：35.54 mmBase Number Matches：1

BCM3814B60E15A3C02 数据手册

 浏览型号BCM3814B60E15A3C02的Datasheet PDF文件第2页浏览型号BCM3814B60E15A3C02的Datasheet PDF文件第3页浏览型号BCM3814B60E15A3C02的Datasheet PDF文件第4页浏览型号BCM3814B60E15A3C02的Datasheet PDF文件第5页浏览型号BCM3814B60E15A3C02的Datasheet PDF文件第6页浏览型号BCM3814B60E15A3C02的Datasheet PDF文件第7页 
BCM® in a VIA Package  
Bus Converter  
BCM3814x60E15A3yzz  
S
®
C
NRTL US  
C
US  
Isolated Fixed-Ratio DC-DC Converter  
Features & Benefits  
Product Ratings  
• Up to 130A continuous low voltage side current  
• Fixed transformation ratio (K) of 1/4  
• Up to 1000W/in3 power density  
• 97.4% peak efficiency  
VHI = 54V (36 – 60V)  
ILO = up to 130A  
K = 1/4  
VLO = 13.5V (9 – 15V)  
(no load)  
Product Description  
• Integrated ceramic capacitance filtering  
• Parallel operation for multi-kW arrays  
• OV, OC, UV, short circuit and thermal protection  
• 3814 package  
The BCM3814x60E15A3yzz in a VIA package is a high efficiency  
Bus Converter, operating from a 36 to 60VDC high voltage bus to  
deliver an isolated 9 to 15VDC unregulated, low voltage.  
This unique ultra-low profile module incorporates DC-DC  
conversion, integrated filtering and PMBus™ commands and  
controls in a chassis or PCB mount form factor.  
• High MTBF  
• Thermally enhanced VIA package  
• PMBus™ management interface  
The BCM offers low noise, fast transient response and industry  
leading efficiency and power density. A low voltage side referenced  
PMBus compatible telemetry and control interface provides access  
to the BCM’s configuration, fault monitoring and other  
telemetry functions.  
Typical Applications  
• DC Power Distribution  
• Information and Communication  
Technology (ICT) Equipment  
Leveraging the thermal and density benefits of Vicor’s VIA  
packaging technology, the BCM module offers flexible thermal  
management options with very low top and bottom side  
thermal impedances.  
• High End Computing Systems  
• Automated Test Equipment  
• Industrial Systems  
When combined with downstream Vicor DC-DC conversion  
components and regulators, the BCM allows the Power Design  
Engineer to employ a simple, low-profile design, which will  
differentiate the end system without compromising on cost or  
performance metrics.  
• High Density Energy Systems  
• Transportation  
Size:  
3.76 x 1.40 x 0.37in  
[95.59 x 35.54 x 9.40mm]  
Part Ordering Information  
High  
Side  
Voltage  
Range  
Ratio  
Max  
High  
Side  
Max  
Low  
Side  
Max  
Low  
Product  
Function  
Package  
Length  
Package  
Width  
Package  
Type  
Product Grade  
Option Field  
Side (Case Temperature)  
Voltage  
Voltage Current  
BCM  
38  
14  
x
60  
E
15 A3  
y
zz  
02 = Chassis/PMBus/Positive Logic [b]  
06 = Short Pin/PMBus/Positive Logic  
10 = Long Pin/PMBus/Positive Logic  
N2 = Chassis/PMBus/Negative Logic [b]  
N6 = Short Pin/PMBus/Negative Logic  
NX = Long Pin/PMBus/Negative Logic  
BCM =  
Bus  
Length in  
Width in  
B = Board VIA  
C = –20 to 100°C [a]  
T = –40 to 100°C [a]  
Internal Reference  
Converter Inches x 10 Inches x 10 V = Chassis VIA  
Module  
[a] High temperature current derating may apply; See Figure 1, specified thermal operating area.  
[b] Positive Logic = Part is default ON, Negative Logic = Part is default OFF  
BCM® in a VIA Package  
Page 1 of 41  
Rev 2.0  
02/2018  
1234567...41

中文翻译

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