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BC848CDW1T1 PDF预览

BC848CDW1T1

更新时间: 2024-11-27 22:28:27
品牌 Logo 应用领域
安森美 - ONSEMI 晶体小信号双极晶体管
页数 文件大小 规格书
6页 110K
描述
Dual General Purpose Transistors

BC848CDW1T1 技术参数

是否无铅: 含铅生命周期:End Of Life
零件包装代码:SC-88包装说明:CASE 419B-02, SC-88, 6 PIN
针数:6Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.22
Is Samacsys:N最大集电极电流 (IC):0.1 A
集电极-发射极最大电压:30 V配置:SEPARATE, 2 ELEMENTS
最小直流电流增益 (hFE):420JESD-30 代码:R-PDSO-G6
JESD-609代码:e0湿度敏感等级:1
元件数量:2端子数量:6
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240极性/信道类型:NPN
最大功率耗散 (Abs):0.38 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:30
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
标称过渡频率 (fT):100 MHzBase Number Matches:1

BC848CDW1T1 数据手册

 浏览型号BC848CDW1T1的Datasheet PDF文件第2页浏览型号BC848CDW1T1的Datasheet PDF文件第3页浏览型号BC848CDW1T1的Datasheet PDF文件第4页浏览型号BC848CDW1T1的Datasheet PDF文件第5页浏览型号BC848CDW1T1的Datasheet PDF文件第6页 
BC846BDW1T1,  
BC847BDW1T1,  
BC848CDW1T1  
Dual General Purpose  
Transistors  
http://onsemi.com  
NPN Duals  
(3)  
(2)  
(1)  
Q
These transistors are designed for general purpose amplifier  
applications. They are housed in the SOT−363/SC−88 which is  
designed for low power surface mount applications.  
Q
1
2
Device Marking:  
BC846BDW1T1 = 1B  
BC847BDW1T1 = 1F  
BC848CDW1T1 = 1L  
(4)  
(5)  
(6)  
Features  
DIAGRAM  
MARKING  
Pb−Free Package is Available  
SOT−363  
CASE 419B  
STYLE 1  
6
1xm  
MAXIMUM RATINGS  
1
Rating  
Symbol BC846 BC847 BC848 Unit  
CollectorEmitter Voltage  
CollectorBase Voltage  
EmitterBase Voltage  
V
V
V
65  
80  
45  
50  
30  
30  
V
V
CEO  
CBO  
EBO  
1x = Specific Device Code  
= B, F, L  
m = Date Code  
x
6.0  
100  
6.0  
100  
5.0  
100  
V
Collector Current −  
Continuous  
I
C
mAdc  
ORDERING INFORMATION  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits  
are exceeded, device functional operation is not implied, damage may occur  
and reliability may be affected.  
Device  
Package  
SOT−363  
SOT−363  
Shipping  
BC846BDW1T1  
BC847BDW1T1  
3000 Units/Reel  
3000 Units/Reel  
3000 Units/Reel  
THERMAL CHARACTERISTICS  
BC847BDW1T1G SOT−363  
(Pb−Free)  
Characteristic  
Symbol  
Max  
Unit  
Total Device Dissipation  
Per Device  
P
D
380  
250  
mW  
BC848CDW1T1  
SOT−363  
3000 Units/Reel  
FR5 Board (Note 1)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
T = 25°C  
A
Derate Above 25°C  
3.0  
mW/°C  
°C/W  
Thermal Resistance,  
Junction−to−Ambient  
R
328  
q
JA  
Junction and Storage  
Temperature Range  
T , T  
55 to +150  
°C  
J
stg  
1. FR−5 = 1.0 x 0.75 x 0.062 in  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
June, 2004 − Rev. 3  
BC846BDW1T1/D  
 

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