BC847BW/DG

更新时间： 2024-01-08 10:10:57

品牌	Logo	应用领域
恩智浦 - NXP		晶体晶体管
页数	文件大小	规格书
15页	97K
描述
45 V, 100 mA NPN general-purpose transistors

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技术参数
数据手册

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BC847BW/DG 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	compliant	风险等级：	5.84
JESD-609代码：	e3	端子面层：	Matte Tin (Sn)
Base Number Matches：	1

BC847BW/DG 数据手册

BC847/BC547 series

NXP Semiconductors

45 V, 100 mA NPN general-purpose transistors

5. Limiting values

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_CBO

V_CEO

V_EBO

I_C

Parameter

Conditions

Min

Max

Unit

collector-base voltage

open emitter

collector-emitter voltage open base

emitter-base voltage

collector current

open collector

100

200

I_CM

peak collector current

single pulse;

t_p≤ 1 ms

I_BM

P_tot

peak base current

single pulse;

t_p≤ 1 ms

100

total power dissipation

SOT23

T_amb≤ 25 °C

[1]

250

200

150

250

500

150

+150

°C

SOT323

[1]

SOT416

[2][3]

[1]

SOT883

SOT54

T_j

junction temperature

ambient temperature

storage temperature

T_amb

T_stg

−65

°C

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[2] Reﬂow soldering is the only recommended soldering method.

[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.

6. Thermal characteristics

Table 7.

Thermal characteristics

Parameter

Symbol

Conditions

Min

Typ

Max

Unit

R_th(j-a)

thermal resistance from in free air

junction to ambient

[1]

SOT23

500

625

833

500

250

K/W

SOT323

SOT416

SOT883

SOT54

[1]

[2][3]

[1]

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[2] Reﬂow soldering is the only recommended soldering method.

[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.

BC847_BC547_SER_7

Product data sheet

Rev. 07 — 10 December 2008

5 of 15

1 2 3 456 7 8...15

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