Nexperia
BC807H series
45 V, 500 mA PNP general-purpose transistors
6. Thermal characteristics
Table 7. Thermal characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
470
340
325
280
110
Unit
K/W
K/W
K/W
K/W
K/W
Rth(j-a)
thermal resistance from junction to ambient
in free air
[1]
[2]
[3]
[4]
-
-
-
-
-
-
R(j-sp)
thermal resistance from junction to solder point
[1] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated and standard footprint.
[2] Device mounted on an FR4 Printed-Circuit-Board (PCB); single-sided copper; tin-plated; mounting pad for collector 1 cm2.
[3] Device mounted on an FR4 Printed-Circuit-Board (PCB); 4-layer copper; tin-plated and standard footprint.
[4] Device mounted on an FR4 Printed-Circuit-Board (PCB); 4-layer copper; tin-plated; mounting pad for collector 1 cm2.
aaa-029556
3
10
duty cycle = 1
Z
th(j-a)
(K/W)
0.75
0.50
0.20
0.33
2
10
0.10
0.02
0.05
0.01
10
0
1
-1
10
-5
-4
-3
10
-2
-1
2
3
10
10
10
10
1
10
10
10
t
(s)
p
FR4 PCB; single-sided copper; tin-plated and standard footprint
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-029557
3
10
Z
duty cycle = 1
th(j-a)
(K/W)
0.75
0.50
2
10
0.33
0.20
0.10
0.05
10
0.02
0.01
0
1
10
-5
-4
-3
-2
10
-1
2
3
10
10
10
1
10
10
10
t
(s)
p
FR4 PCB; single-sided copper; tin-plated; mounting pad for collector 1 cm2
Fig. 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
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BC807H_SER
All information provided in this document is subject to legal disclaimers.
Nexperia B.V. 2019. All rights reserved
Product data sheet
Rev. 1 — 5 March 2019
5 / 21