SPICE MODEL: BAV99DW
BAV99DW
QUAD SURFACE MOUNT SWITCHING DIODE ARRAY
Features
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Fast Switching Speed
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
A
SOT-363
Dim
A
B
C
D
F
Min
0.10
1.15
2.00
Max
0.30
1.35
2.20
C
B
Two “BAV99” Circuits In One Package
Lead Free/RoHS Compliant (Note 4)
Qualified to AEC-Q101 Standards for High Reliability
H
0.65 Nominal
Mechanical Data
K
J
M
0.30
1.80
¾
0.40
2.20
0.10
1.00
0.40
0.25
8°
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Case: SOT-363
H
J
·
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
L
D
F
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Moisture Sensitivity: Level 1 per J-STD-020C
AC
1
C2
A2
K
L
0.90
0.25
0.10
0°
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe). Please See Ordering Information, Note 6, on
Page 3
M
a
AC
2
A1
C1
TOP VIEW
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Polarity: See Diagram
All Dimensions in mm
Marking: KJG (See Page 3)
Weight: 0.006 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings
Characteristic
Symbol
Value
Unit
VRM
Non-Repetitive Peak Reverse Voltage
100
V
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
75
VR(RMS)
IFM
RMS Reverse Voltage
53
V
Forward Continuous Current (Note 1)
215
mA
Non-Repetitive Peak Forward Surge Current @ t = 1.0ms
2.0
1.0
0.5
IFSM
A
@ t = 1.0ms
@ t = 1.0s
Pd
RqJA
Power Dissipation (Note 1)
200
625
mW
°C/W
mW
°C/W
°C
Thermal Resistance Junction to Ambient Air (Note 1)
Power Dissipation (Note 2)
Pd
300
RqJA
Thermal Resistance Junction to Ambient Air (Note 2)
Operating and Storage Temperature Range
417
Tj , TSTG
-65 to +150
Electrical Characteristics @ T
A = 25°C unless otherwise specified
Characteristic
Symbol
Min
Max
¾
Unit
Test Condition
V(BR)R
Reverse Breakdown Voltage (Note 3)
IR = 2.5mA
75
V
0.715
0.855
1.0
IF = 1.0mA
IF = 10mA
IF = 50mA
IF = 150mA
VF
Forward Voltage (Note 3)
Reverse Current (Note 3)
¾
¾
V
1.25
VR = 75V
2.5
50
30
25
mA
mA
mA
nA
V
V
V
R = 75V, Tj = 150°C
R = 25V, Tj = 150°C
R = 20V
IR
VR = 0, f = 1.0MHz
CT
trr
Total Capacitance
¾
¾
2.0
4.0
pF
ns
IF = IR = 10mA,
Irr = 0.1 x IR, RL = 100W
Reverse Recovery Time
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Device mounted on Alumina PCB, 0.4 inch x 0.3 inch x 0.024 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Short duration test pulse used to minimize self-heating effect.
4. No purposefully added lead.
DS30145 Rev. 9 - 2
1 of 3
BAV99DW
www.diodes.com
ã Diodes Incorporated