Datasheet > BAT54CDW-7

BAT54CDW-7

更新时间： 2024-11-01 12:21:19

品牌	Logo	应用领域
鲁光 - LGE		二极管
页数	文件大小	规格书
2页	276K
描述
Surface Mount Schottky Barrier Diode Arrays

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中文翻译

获取价格

数据手册

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BAT54CDW-7 数据手册

BAT54TW/ADW/CDW/SDW/BRW

Surface Mount Schottky Barrier Diode Arrays

SOT-363

Features

Low Forward Voltage Drop

Fast Switching

Ultra-Small Surface Mount Package

PN Junction Guard Ring for Transient and

ESD Protection

Mechanical Data

Case: SOT-363, Molded Plastic

Case Material - UL Flammability Rating

Classification 94V-0

Moisture sensitivity: Level 1 per J-STD-020A

Terminals: Solderable per MIL-STD-202,

Method 208

Orientation: See Diagrams Below

Weight: 0.006 grams (approx.)

Marking: See Diagrams Below & Page 2

Dimensions in inches and (millimeters)

C₂

A₁

C₂

A₂

C₃

C₁

A₂

C₂

C₁

C₂

C₁

A₂

C₁

C₂

A₃

A₁

C₁

A₁

A₂

A₁

BAT54SDW*

Marking: KL8

BAT54CDW*

Marking: KL7

BAT54TW

Marking: KLA

BAT54ADW*

Marking: KL6

BAT54BRW

Marking: KLB

*Symmetrical configuration, no orientation indicator.

@ T_A= 25°C unless otherwise specified

Maximum Ratings

Characteristic

Symbol

Value

Unit

V_RRM

V_RWM

V_R

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

I_F

I_FRM

I_FSM

200

300

Forward Continuous Current (Note 1)

Repetitive Peak Forward Current (Note 1)

Forward Surge Current (Note 1)

Power Dissipation (Note 1)

600

@ t < 1.0s

P_d

200

°C/W

°C

R_qJA

T_j, T_STG

Thermal Resistance, Junction to Ambient Air (Note 1)

Operating and Storage Temperature Range

625

-65 to +125

@ T_A= 25°C unless otherwise specified

Electrical Characteristics

Characteristic

Symbol Min

Typ

Max

Unit

Test Condition

_R= 100mA

I_F= 0.1mA

V_(BR)R

Reverse Breakdown Voltage (Note 2)

240

320

400

500

1000

I_F= 1mA

I_F= 10mA

I_F= 30mA

I_F= 100mA

Forward Voltage (Note 2)

V_F

_R= 25V

_R= 1.0V, f = 1.0MHz

I_R

Reverse Leakage Current (Note 2)

Total Capacitance

2.0

C_T

I_F= 10mA through I_R= 10mA

to I_R= 1.0mA, R_L= 100W

t_rr

Reverse Recovery Time

5.0

Notes:

1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc.

2. Short duration test pulse used to minimize self-heating effect.

http://www.luguang.cn

mail:lge@luguang.cn

中文翻译

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