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BAT30S_R2_00001 PDF预览

BAT30S_R2_00001

更新时间: 2024-11-26 01:13:55
品牌 Logo 应用领域
强茂 - PANJIT 光电二极管
页数 文件大小 规格书
6页 70K
描述
SMALL SIGNAL SCHOTTKY DIODES

BAT30S_R2_00001 技术参数

生命周期:Active包装说明:GREEN, PLASTIC PACKAGE-3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.70风险等级:5.67
配置:SERIES CONNECTED, CENTER TAP, 2 ELEMENTS二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJESD-30 代码:R-PDSO-G3
元件数量:2端子数量:3
最高工作温度:150 °C最大输出电流:0.3 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE最大重复峰值反向电压:30 V
表面贴装:YES技术:SCHOTTKY
端子形式:GULL WING端子位置:DUAL
Base Number Matches:1

BAT30S_R2_00001 数据手册

 浏览型号BAT30S_R2_00001的Datasheet PDF文件第2页浏览型号BAT30S_R2_00001的Datasheet PDF文件第3页浏览型号BAT30S_R2_00001的Datasheet PDF文件第4页浏览型号BAT30S_R2_00001的Datasheet PDF文件第5页浏览型号BAT30S_R2_00001的Datasheet PDF文件第6页 
BAT30S  
SMALL SIGNAL SCHOTTKY DIODES  
CURRENT  
300 mA  
30 Volt  
VOLTAGE  
FEATURES  
0.120(3.04)  
0.110(2.80)  
• Very low conduction losses  
• Negligible switching losses  
• Low forward and reverse recovery times  
• Extremely Fast Switching  
• Surface mount device  
0.056(1.40)  
0.047(1.20)  
• Low capacitance diode  
0.008(0.20)  
0.003(0.08)  
0.079(2.00)  
0.070(1.80)  
• Lead free in compliance with EU RoHS 2011/65/EU directive  
• Green molding compound as per IEC61249 Std. .  
(Halogen Free)  
0.004(0.10)  
0.000(0.00)  
0.044(1.10)  
0.035(0.90)  
MECHANICAL DATA  
0.020(0.50)  
0.013(0.35)  
• Case: SOT-23, Plastic  
Terminals: Solderable per MIL-STD-750, Method 2026  
SERIES  
• Weight: 0.0003 ounce, 0.0084 gram  
• Marking: L33  
ABSOLUTE RATINGS@ TJ=25oC, UNLESS OTHERWISE SPECIFIED  
PARAMETER  
SYMBOL  
VALUE  
UNIT  
Repetitive peak reverse voltage  
VRRM  
30  
V
Continuous forward current  
IO  
IFSM  
TSTG  
TJ  
300  
mA  
A
Surge non repetitive forward current  
Storage temperature range  
tp=8.3ms Sinusoidal  
1
-65 to + 150  
150  
oC  
OC  
Operating junction temperature (Note 1)  
Soldering temperature  
TL  
260  
oC  
1. Pulse test : tp=5ms, δ < 2%  
THERMAL CHARACTERISTICS  
PARAMETER  
SYMBOL  
RθJA  
VALUE  
500  
UNIT  
oC/W  
Junction to ambient (Note 2)  
2. On epoxy printed circuit board with recommended pad layout  
REV.0.0-MAR.3.2010  
STAD-MAR.15.2010-1  
PAGE . 1  

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