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BAS20 PDF预览

BAS20

更新时间: 2024-11-30 08:48:19
品牌 Logo 应用领域
美微科 - MCC 整流二极管信号二极管光电二极管
页数 文件大小 规格书
3页 169K
描述
Small Signal Diodes 250mW

BAS20 技术参数

是否Rohs认证: 不符合生命周期:Active
零件包装代码:SOT-23包装说明:SOT-23, 3 PIN
针数:3Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.70
风险等级:5.07Is Samacsys:N
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJESD-30 代码:R-PDSO-G3
JESD-609代码:e0元件数量:1
端子数量:3最大输出电流:0.2 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):240
最大功率耗散:0.25 W认证状态:Not Qualified
最大重复峰值反向电压:200 V最大反向恢复时间:0.05 µs
表面贴装:YES技术:SCHOTTKY
端子面层:TIN LEAD端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:30
Base Number Matches:1

BAS20 数据手册

 浏览型号BAS20的Datasheet PDF文件第2页浏览型号BAS20的Datasheet PDF文件第3页 
BAS19  
THRU  
BAS21  
M C C  
TM  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Micro Commercial Components  
Features  
Ideally Suited for Automatic Insertion  
150oC Junction Temperature  
Fast Switching speed  
Small  
Signal Diodes  
250mW  
Epitaxial Planar Die Construction  
Mechanical Data  
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
SOT-23  
Top View  
A
Weight: 0.008 grams ( approx.)  
D
3
Repetitive  
Peak  
Reverse  
Voltage  
VRRM (V)  
Continuous  
B
C
Reverse  
Voltage  
VR (V)  
MCC Part  
Number  
1
2
Marking  
F
E
BAS19  
BAS20  
BAS21  
JP  
JR  
JS  
100  
150  
200  
120  
200  
250  
H
G
J
K
DIMENSIONS  
MM  
Maximum Ratings @ 25oC Unless Otherwise Specified  
INCHES  
MIN  
DIM  
A
B
C
D
E
MAX  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
NOTE  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
.100  
1.12  
.180  
.51  
Parameter Symbol Value Unit  
Non-repetitive Peak  
Forward Surge Current @ t=1s  
Average Rectified Forward Current  
Forward DC Current at Tamb=25oC  
Repetitive Peak Forward Current  
Power Dissipation up to Tamb=25oC  
Thermal Resistance Junction to  
Ambient  
@ t=1us  
2.5  
0.5  
IFSM  
A
F
G
H
J
(1)  
IF(AV)  
IF  
mA  
mA  
mA  
mW  
200  
.085  
.37  
K
(2)  
200  
625  
250  
Suggested Solder  
Pad Layout  
IFRM  
P
.031  
.800  
tot  
oC/W  
oC  
R
.035  
.900  
430  
JA  
.079  
2.000  
inches  
mm  
T, TSTG  
Operating & Storage Temperature  
-65~150  
j
Notes: (1) Measured under pulse conditions;  
Pulse time = tp <= 0.3ms  
.037  
.950  
.037  
.950  
(2) Device on fiberglass substrate,  
See layout on next page  
www.mccsemi.com  
Revision: A  
2011/01/01  
1 of 3  

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