BAS20DW-BAS21DW
SURFACE MOUNT LOW LEAKAGE DIODE
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Features
Mechanical Data
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Fast Switching Speed
Surface Mount Package Ideally Suited for Automated Insertion
High Reverse Breakdown Voltage
Low Leakage Current
Lead Free By Design/RoHS Compliant (Note 3)
"Green" Device (Notes 4 and 5)
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Case: SOT-363
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: See Diagram
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Terminals: Finish ⎯ Matte Tin annealed over Alloy 42
leadframe. Solderable per MIL-STD-202, Method 208
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Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.003 grams (approximate)
SOT-363
TOP VIEW
Internal Schematic
TOP VIEW
Maximum Ratings @T = 25°C unless otherwise specified
A
Characteristic
Repetitive Peak Reverse Voltage
Symbol
VRRM
VRWM
VR
BAS20DW
BAS21DW
Unit
V
200
250
Working Peak Reverse Voltage
DC Blocking Voltage
150
106
200
141
V
RMS Reverse Voltage
V
VR(RMS)
IFM
Forward Continuous Current
Average Rectified Output Current
400
200
mA
mA
IO
2.5
0.5
625
Non-Repetitive Peak Forward Surge Current
@ t = 1.0μs
@ t = 1.0s
A
IFSM
IFRM
Repetitive Peak Forward Surge Current
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Symbol
PD
Rθ
Value
200
625
Unit
mW
°C/W
°C
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
JA
-65 to +150
TJ, TSTG
Electrical Characteristics @T = 25°C unless otherwise specified
A
Characteristic
Reverse Breakdown Voltage (Note 2)
Symbol
Min
200
250
Max
⎯
⎯
Unit
Test Condition
IR = 100μA
BAS20DW
BAS21DW
V
V(BR)R
IF = 100mA
IF = 200mA
1.0
1.25
Forward Voltage
V
VF
⎯
nA
μA
pF
Tj = 25°C
Tj = 100°C
VR = 0, f = 1.0MHz
IF = IR = 30mA,
Irr = 0.1 x IR, RL = 100Ω
Reverse Current
@ Rated DC Blocking Voltage (Note 2)
100
15
IR
CT
trr
⎯
⎯
⎯
Total Capacitance
5.0
Reverse Recovery Time
50
ns
Notes:
1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
1 of 4
www.diodes.com
May 2009
© Diodes Incorporated
BAS20DW-BAS21DW
Document number: DS30617 Rev. 10 - 2
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