WTE
PO WER SEMICONDUCTORS
B1S – B8S
0.5A MINI SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
Features
!
Glass Passivated Die Construction
G
D
!
!
!
!
!
Low Forward Voltage Drop
High Current Capability
High Surge Current Capability
Designed for Surface Mount Application
Plastic Material – UL Recognition Flammability
Classification 94V-O
-
+
~
H
B
~
E
C
M
MB-S
Min
4.50
3.80
0.006
—
A
K
L
Dim
A
Max
4.90
4.20
0.35
0.20
7.0
Mechanical Data
J
B
!
!
Case: Molded Plastic
C
Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
Polarity: As Marked on Case
Weight: 0.22 grams (approx.)
Mounting Position: Any
D
E
—
!
!
!
!
G
H
0.70
1.30
2.30
2.30
—
1.10
1.70
2.70
2.70
3.00
0.80
J
Marking: Type Number
K
L
M
0.50
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Symbol
B1S
B2S
B4S
B6S
B8S
Unit
VRRM
VRWM
VR
100
70
200
140
400
600
420
800
560
V
RMS Reverse Voltage
VR(RMS)
IO
280
0.5
V
A
Average Rectified Output Current
@TA = 40°C
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
(JEDEC Method)
I
FSM
30
A
I2t Rating for Fusing (t < 8.35ms)
I2t
10
A2s
V
Forward Voltage per element
@IF = 0.5A
VFM
IRM
1.0
Peak Reverse Current
At Rated DC Blocking Voltage
@TA = 25°C
@TA = 125°C
5.0
500
µA
Typical Junction Capacitance (per leg) (Note 1)
Typical Thermal Resistance (per leg) (Note 2)
Operating and Storage Temperature Range
Cj
25
85
pF
K/W
°C
RꢀJA
Tj, TSTG
-55 to +150
Note: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
2. Thermal resistance junction to ambient mounted on PC board with 13mm2 copper pads.
B1S – B8S
1 of 3
© 2002 Won-Top Electronics