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AX1000-1FGG896I PDF预览

AX1000-1FGG896I

更新时间: 2024-11-30 06:38:47
品牌 Logo 应用领域
ACTEL 现场可编程门阵列可编程逻辑时钟
页数 文件大小 规格书
226页 2293K
描述
Axcelerator Family FPGAs

AX1000-1FGG896I 技术参数

是否Rohs认证:符合生命周期:Transferred
包装说明:1 MM PITCH, FBGA-896Reach Compliance Code:compliant
风险等级:5.77Is Samacsys:N
其他特性:1000000 SYSTEM GATES AVAILABLE最大时钟频率:763 MHz
CLB-Max的组合延迟:0.84 nsJESD-30 代码:S-PBGA-B896
JESD-609代码:e1长度:31 mm
湿度敏感等级:3可配置逻辑块数量:12096
等效关口数量:612000输入次数:516
逻辑单元数量:18144输出次数:516
端子数量:896最高工作温度:85 °C
最低工作温度:-40 °C组织:12096 CLBS, 612000 GATES
封装主体材料:PLASTIC/EPOXY封装代码:BGA
封装等效代码:BGA896,30X30,40封装形状:SQUARE
封装形式:GRID ARRAY峰值回流温度(摄氏度):250
电源:1.5,1.5/3.3,2.5/3.3 V可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
认证状态:Not Qualified座面最大高度:2.44 mm
子类别:Field Programmable Gate Arrays最大供电电压:1.575 V
最小供电电压:1.425 V标称供电电压:1.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:31 mmBase Number Matches:1

AX1000-1FGG896I 数据手册

 浏览型号AX1000-1FGG896I的Datasheet PDF文件第2页浏览型号AX1000-1FGG896I的Datasheet PDF文件第3页浏览型号AX1000-1FGG896I的Datasheet PDF文件第4页浏览型号AX1000-1FGG896I的Datasheet PDF文件第5页浏览型号AX1000-1FGG896I的Datasheet PDF文件第6页浏览型号AX1000-1FGG896I的Datasheet PDF文件第7页 
v2.7  
Axcelerator Family FPGAs  
u
e
Voltage-Referenced I/O Standards: GTL+, HSTL  
Class 1, SSTL2 Class 1 and 2, SSTL3 Class 1 and 2  
Registered I/Os  
Hot-Swap Compliant I/Os (except PCI)  
Programmable Slew Rate and Drive Strength on  
Outputs  
Leading-Edge Performance  
350+ MHz System Performance  
500+ MHz Internal Performance  
High-Performance Embedded FIFOs  
700 Mb/s LVDS Capable I/Os  
Specifications  
Programmable Delay and Weak Pull-Up/Pull-Down  
Circuits on Inputs  
Up to 2 Million Equivalent System Gates  
Up to 684 I/Os  
Up to 10,752 Dedicated Flip-Flops  
Up to 295 kbits Embedded SRAM/FIFO  
Manufactured on Advanced 0.15 μm CMOS Antifuse  
Process Technology, 7 Layers of Metal  
Embedded Memory:  
Variable-Aspect 4,608-bit RAM Blocks (x1, x2, x4,  
x9, x18, x36 Organizations Available)  
Independent, Width-Configurable Read and Write Ports  
Programmable Embedded FIFO Control Logic  
Segmentable Clock Resources  
Embedded Phase-Locked Loop:  
Features  
Single-Chip, Nonvolatile Solution  
14-200 MHz Input Range  
Frequency Synthesis Capabilities up to 1 GHz  
Up to 100% Resource Utilization with 100% Pin Locking  
1.5V Core Voltage for Low Power  
Footprint Compatible Packaging  
Deterministic, User-Controllable Timing  
Unique In-System Diagnostic and Debug Capability  
with Actel Silicon Explorer II  
Flexible, Multi-Standard I/Os:  
1.5V, 1.8V, 2.5V, 3.3V Mixed Voltage Operation  
Bank-Selectable I/Os – 8 Banks per Chip  
Single-Ended I/O Standards: LVTTL, LVCMOS, 3.3V  
PCI, and 3.3V PCI-X  
Boundary-Scan Testing Compliant with IEEE Standard  
1149.1 (JTAG)  
FuseLockTM Secure Programming Technology  
Prevents Reverse Engineering and Design Theft  
Differential I/O Standards: LVPECL and LVDS  
Table 1-1 Axcelerator Family Product Profile  
Device  
AX125  
125,000  
82,000  
AX250  
250,000  
154,000  
AX500  
500,000  
286,000  
AX1000  
1,000,000  
612,000  
AX2000  
2,000,000  
1,060,000  
Capacity (in Equivalent System Gates)  
Typical Gates  
Modules  
Register (R-cells)  
Combinatorial (C-cells)  
Maximum Flip-Flops  
Embedded RAM/FIFO  
Number of Core RAM Blocks  
Total Bits of Core RAM  
Clocks (Segmentable)  
Hardwired  
672  
1,344  
1,344  
1,408  
2,816  
2,816  
2,688  
5,376  
5,376  
6,048  
12,096  
12,096  
10,752  
21,504  
21,504  
4
12  
55,296  
16  
73,728  
36  
165,888  
64  
294,912  
18,432  
4
4
8
4
4
8
4
4
8
4
4
8
4
4
8
Routed  
PLLs  
I/Os  
I/O Banks  
8
8
8
8
8
Maximum User I/Os  
Maximum LVDS Channels  
Total I/O Registers  
Package  
168  
84  
504  
248  
124  
744  
336  
168  
1,008  
516  
258  
1,548  
684  
342  
2,052  
CSP  
180  
PQFP  
208  
208  
BGA  
FBGA  
CQFP  
729  
484, 676, 896  
352  
256, 324  
256, 484  
208, 352  
484, 676  
208, 352  
896, 1152  
352  
CCGA  
624  
624  
November 2008  
i
© 2008 Actel Corporation  
*See Actel’s website for the latest version of the datasheet.  

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