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AVSMBJ16A PDF预览

AVSMBJ16A

更新时间: 2024-11-07 03:58:15
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
3页 116K
描述
Trans Voltage Suppressor Diode, 600W, 16V V(RWM), Unidirectional, 1 Element, Silicon, DO-214AA, PLASTIC PACKAGE-2

AVSMBJ16A 数据手册

 浏览型号AVSMBJ16A的Datasheet PDF文件第2页浏览型号AVSMBJ16A的Datasheet PDF文件第3页 
AVSMBJ5.0A thru AVSMBJ170A, CA e3 and  
AVSMBG5.0A thru AVSMBG170A, CA, e3  
SURFACE MOUNT 600 Watt  
Transient Voltage Suppressor  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
PACKAGE  
This AVSMBJ5.0A-170A or AVSMBG5.0A-170A series of surface mount 600 W Transient  
Voltage Suppressors (TVSs) protects a variety of voltage-sensitive components from  
destruction or degradation. It is available in J-bend design (AVSMBJ) with the DO-214AA  
package for greater PC board mounting density or in a Gull-wing design (AVSMBG) in the  
DO-215AA for visible solder connections.  
It is available in both unidirectional and  
bidirectional configurations with an A or CA suffix part number as well as RoHS Compliant  
designated by an “e3”suffix. Their clamping response time is virtually instantaneous. As a  
result, they can be used for protection from ESD or EFT per IEC61000-4-2 and IEC61000-  
4-4, or for inductive switching environments and induced RF protection. They can also  
protect from secondary lightning effects per IEC61000-4-5 and class levels defined herein.  
Microsemi also offers numerous other TVS products to meet higher and lower power  
demands and special applications.  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Compliant to IEC61000-4-2 and IEC61000-4-4 for ESD  
and EFT protection respectively  
Selections for 5.0 to 170 volts standoff voltages (VWM)  
100% screened as follows for avionics applications:  
1. Temperature Cycle (thermal shock) 20 Cycles -55°C to 125°C  
2. Solder Capability: Stress Tested at 260°C for 10 sec.  
3. Surge 1 pulse at 110% Ipp (Both Directions for Bidirectional)  
4. Surge 1 pulse at 100% Ipp (Both Directions for Bidirectional)  
5. Electrical Test  
Secondary lightning protection per IEC61000-4-5 with 42  
Ohms source impedance:  
Class 1: AVSMB 5.0 to AVSMB 120A or CA  
Class 2: AVSMB 5.0 to AVSMB 60A or CA  
Class 3: AVSMB 5.0 to AVSMB 30A or CA  
Class 4: AVSMB 5.0 to AVSMB 15A or CA  
6. Burn-in (HTRB) 48 hrs 125°C Polarity A for Bidirectional (96 hrs  
for Unidirectional)  
Secondary lightning protection per IEC61000-4-5 with 12  
Ohms source impedance:  
7. Electrical Test Delta ID and V(BR) Polarity A  
Class 1: AVSMB 5.0 to AVSMB 36A or CA  
Class 2: AVSMB 5.0 to AVSMB 18A or CA  
8. Burn-in (HTRB) 48 hrs 125°C Polarity B for bidirectional (not  
required for Unidirectional)  
Compliant to RTCA/DO-160E Waveform 4, Levels 1 & 2  
9. Electrical Test Delta ID and V(BR) Polarity B (Not required for  
Unidirectional)  
Compliant to RTCA/DO-160E Waveform 4, Level 3 for  
AVSMB5.0 to AVSMB20A or CA  
10. Electrical Test GO-NO-GO  
Compliant to RTCA/DO-160E Waveform 4, Level 4 for  
AVSMB5.0 to AVSMB7.5  
RoHS Compliant devices available and designated by  
adding an “e3” suffix  
Economical surface mount design in both J-bend or Gull-wing  
terminations.  
Compliant to RTCA/DO-160E Waveform 5A, Level 1  
Compliant to RTCA/DO-160E Waveform 5A, Level 2 for  
AVSMB5.0 to AVSMB6.0A or CA  
Protects sensitive components such as IC’s, CMOS, Bipolar,  
BiCMOS, ECL, DTL, T2L, etc.  
Protection from switching transients & induced RF  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
2-Stage: Robust, High Reliability Lead Frame  
Peak Pulse Power dissipation at 25ºC: 600 watts at 10/1000 μs  
(also see Fig 1,2, and 3)  
CASE: Void-free transfer molded thermosetting epoxy  
body meeting UL94V-0  
Impulse repetition rate (duty factor): 0.01%  
tclamping (0 volts to V(BR) min.): < 100 ps theoretical for  
unidirectional and < 5 ns for bidirectional  
TERMINALS: Gull-wing or C-bend (modified J-bend)  
leads Tin-Lead or RoHS compliant annealed matte-Tin  
plating solderable per MIL-STD-750, method 2026  
Operating and Storage temperature: -65ºC to +150ºC  
Thermal resistance: 25 ºC/W junction to lead or 90ºC/W junction  
to ambient when mounted on FR4 PC board (1oz Cu) with  
recommended footprint (see last page)  
Steady-State Power dissipation: 5 watts at TL = 25oC, or 1.38  
watts at TA = 25ºC when mounted on FR4 PC board with  
recommended footprint  
POLARITY: Cathode indicated by band. No band on bi-  
directional devices.  
MARKING: See Page 2 marking column.  
TAPE & REEL option: Standard per EIA-481-1-A with 12  
mm tape, 750 per 7 inch reel or 2500 per 13 inch reel.  
WEIGHT: 0.1 grams  
Forward Surge at 25ºC: 100 amps peak impulse of 8.3 ms half-  
sine wave (unidirectional only)  
See package dimension on last page  
Solder temperatures: 260 ºC for 10 s (maximum)  
Copyright 2008  
1-29-2008 REV D; AVSMB5-170  
Microsemi  
Page 1  
Scottsdale Division  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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