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AV80577UG0093M PDF预览

AV80577UG0093M

更新时间: 2024-01-14 16:47:38
品牌 Logo 应用领域
英特尔 - INTEL 外围集成电路
页数 文件大小 规格书
104页 3353K
描述
Microprocessor, 64-Bit, 1200MHz, CMOS, PBGA956, FCBGA-956

AV80577UG0093M 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:BGA, BGA956,44X44,20
针数:956Reach Compliance Code:compliant
风险等级:5.82地址总线宽度:36
位大小:64边界扫描:NO
外部数据总线宽度:64集成缓存:YES
JESD-30 代码:X-PBGA-B956低功率模式:YES
端子数量:956封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA956,44X44,20
封装形状:UNSPECIFIED封装形式:GRID ARRAY
电源:1.2 V认证状态:Not Qualified
速度:1200 MHz子类别:Microprocessors
最大压摆率:18000 mA最大供电电压:1.3 V
最小供电电压:0.75 V标称供电电压:1.2 V
表面贴装:YES技术:CMOS
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOMuPs/uCs/外围集成电路类型:MICROPROCESSOR
Base Number Matches:1

AV80577UG0093M 数据手册

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improve performance of video, audio, and image processing  
for multimedia, encryption, financial, engineering, and scientific  
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rate of one per clock cycle, effectively doubles speed of execu-  
tion over previous-generation processors. 45nm versions include  
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set. This provides additional performance improvements in  
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encoding in high-definition resolution.  
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latency to frequently used data through dynamic allocation  
of shared L2 cache.  
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execution, reduces time in-flight instructions must wait  
for data, and moves data from system memory into fast  
L2 cache prior to execution.  
3URGXFWꢀ%ULHI  
Intel® Core™2 Duo Processors  
Embedded Computing  
Intel® Core2 Duo Processors  
for Embedded Computing  
Processors T9400, P8400, SL9400, SL9380, SP9300, SU9300,  
T7500, T7400, L7500, L7400 and U7500  
Product Overview  
Intel® Core™2 Duo processors – members of Intel’s growing prod-  
uct line of multi-core processors based on Intel® Core™ microarchi-  
tecture – now feature 45nm process technology to deliver even  
greater energy-efficient performance. Intel Core 2 Duo processor  
technology makes it possible to integrate two complete execu-  
tion cores in one physical package, providing advancements in  
simultaneous computing for multi-threaded applications and multi-  
tasking environments. Intel’s hafnium-based 45nm Hi-k silicon  
process technology enables even more processor performance  
by doubling transistor density and increasing cache size by up to  
50 percent. The result is improved speed and efficiency, relative  
to previous-generation dual-core Intel® processors.  
Intel Core 2 Duo processors meet the needs of a wide range  
of performance-intensive, low-power embedded applications  
in smaller form factors such as retail and transaction services  
(i.e., point-of-service terminals and ATMs), gaming platforms,  
industrial control and automation, digital security surveillance  
and medical imaging. While incorporating advanced processor  
technology, they remain software-compatible with previous  
IA-32 processors.  
Arch State  
Arch State  
Execution  
Resources  
Execution  
Resources  
L1 Caches  
APIC  
L1 Caches  
APIC  
Intel® Core™ Microarchitecture  
Shared L2 Cache  
Energy-efficient performance helps equipment manufacturers  
optimally balance processing capabilities within power and  
space constraints.  
Power Mgmt.  
Coordination Logic Coordination Logic  
Core  
Bus Interface  
complete up to four full instructions per clock cycle.  
Intel® Core™2 Duo processors, based on Intel® Core™ microarchi-  
tecture, include two complete execution cores, shared L2 cache,  
and intelligent power management capabilities. These features  
deliver significantly greater performance-per-watt over previous-  
generation dual-core Intel® processors.  

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