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ꢂnteꢄ® Core™ i7 ꢅnd Core™ i5 Processors with
moꢆiꢄe ꢂnteꢄ® Hm76 ꢅnd Qm77 ꢃxpress Chipsets
Intelligent Systems
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3rd Generation Intel Core i7 and Intel Core i5
Processor-based Platforms for Intelligent Systems
Ideal for Intelligent Systems—context-aware, securely managed embedded devices that connect seamlessly
to networks, clouds and each other.
displays, enabling one system to deliver
multiple displays without the need for
a discrete graphics card. Built-in visual
features, including Intel® Clear Video HD
technology and Intel® Quick Sync Video,
mean smoother visual quality, improved
ability to decode and transcode simultane-
ous video streams, and spectacular HD
media playback. Additionally, the platform
supports next-generation graphics APIs,
such as Microsoft DirectX* 11.
Product Overview
Manufactured on industry-leading 22nm
process technology with 3D Tri-Gate tran-
sistors, these 3rd generation Intel® Core™
i7 and Core™ i5 processors offer superior
performance, enhanced media and graphics
capabilities and flexibility, making them
ideal for a wide range of intelligent systems
including retail transaction terminals, digital
signage, digital security and surveillance,
gaming platforms, industrial automation
and medical equipment. As with the 2nd
generation Intel® Core™ processor family,
full integration of the CPU, media/graphics
capabilities and memory controller reduces
overall platform footprint and saves
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Intel® vPro™ technology, enabled when
processors are paired with the Mobile
Intel® QM77 Express chipset, delivers intel-
ligent security, expanded management
capabilities and improved power manage-
ment. The technology supports operating
system-absent manageability and down-
the-wire security even when the system is
powered off, the operating system is unre-
sponsive, or software agents are disabled.
While incorporating advanced technology,
these processors remain software-compat-
ible with previous IA-32 processors.
on-board real estate.
These processors offer quad-core and
dual-core capabilities with performance
and thermal design power (TDP) options
ranging from 17 W to 45 W. Processors in
the BGA package support error correcting
code (ECC) memory.1 When paired with
either the Mobile Intel® HM76 or Mobile
Intel® QM77 Express chipset, this platform
offers faster connectivity with integrated
next-generation I/O technologies such as
PCI Express* Gen 3.0 and USB 3.0. Intel®
Rapid Start Technology2 provides increased
system responsiveness, while support for
DDR3L memory improves power efficiency.
This 3rd generation Intel Core processor
family and Intel® 7 Series chipsets are
pin and package compatible with the 2nd
generation Intel Core processor family
and Intel® 6 Series chipsets, allowing
developers to mix and match processors
and chipsets to better suit their design
needs. Developers can create one board
design and scale a product line, using the
same sockets to help cut design costs and
accelerate time-to-market.
Next-generation Intel® graphics engines
significantly improve graphics and media
performance compared to 2nd genera-
tion Intel Core processor-based platforms.
This platform supports three independent