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AV8063801149203/SR0ND PDF预览

AV8063801149203/SR0ND

更新时间: 2023-12-18 00:00:00
品牌 Logo 应用领域
英特尔 - INTEL 外围集成电路
页数 文件大小 规格书
4页 1359K
描述
Microprocessor, 64-Bit, 2100MHz, CMOS, PBGA1023, FCBGA-1023

AV8063801149203/SR0ND 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:BGA包装说明:BGA, BGA1023(UNSPEC)
针数:1023Reach Compliance Code:compliant
HTS代码:8542.31.00.01风险等级:5.78
位大小:64边界扫描:NO
格式:FIXED POINT集成缓存:YES
JESD-30 代码:R-PBGA-B1023低功率模式:YES
端子数量:1023封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA1023(UNSPEC)
封装形状:RECTANGULAR封装形式:GRID ARRAY
认证状态:Not Qualified速度:2100 MHz
子类别:Microprocessors表面贴装:YES
技术:CMOS端子形式:BALL
端子位置:BOTTOMuPs/uCs/外围集成电路类型:MICROPROCESSOR
Base Number Matches:1

AV8063801149203/SR0ND 数据手册

 浏览型号AV8063801149203/SR0ND的Datasheet PDF文件第2页浏览型号AV8063801149203/SR0ND的Datasheet PDF文件第3页浏览型号AV8063801149203/SR0ND的Datasheet PDF文件第4页 
PlaꢀfOꢁm bꢁꢂꢃf  
ꢂnteꢄ® Core™ i7 ꢅnd Core™ i5 Processors with  
moꢆiꢄe ꢂnteꢄ® Hm76 ꢅnd Qm77 ꢃxpress Chipsets  
Intelligent Systems  
®
®
3rd Generation Intel Core i7 and Intel Core i5  
Processor-based Platforms for Intelligent Systems  
Ideal for Intelligent Systems—context-aware, securely managed embedded devices that connect seamlessly  
to networks, clouds and each other.  
displays, enabling one system to deliver  
multiple displays without the need for  
a discrete graphics card. Built-in visual  
features, including Intel® Clear Video HD  
technology and Intel® Quick Sync Video,  
mean smoother visual quality, improved  
ability to decode and transcode simultane-  
ous video streams, and spectacular HD  
media playback. Additionally, the platform  
supports next-generation graphics APIs,  
such as Microsoft DirectX* 11.  
Product Overview  
Manufactured on industry-leading 22nm  
process technology with 3D Tri-Gate tran-  
sistors, these 3rd generation Intel® Core™  
i7 and Core™ i5 processors offer superior  
performance, enhanced media and graphics  
capabilities and flexibility, making them  
ideal for a wide range of intelligent systems  
including retail transaction terminals, digital  
signage, digital security and surveillance,  
gaming platforms, industrial automation  
and medical equipment. As with the 2nd  
generation Intel® Core™ processor family,  
full integration of the CPU, media/graphics  
capabilities and memory controller reduces  
overall platform footprint and saves  
3
Intel® vPro™ technology, enabled when  
processors are paired with the Mobile  
Intel® QM77 Express chipset, delivers intel-  
ligent security, expanded management  
capabilities and improved power manage-  
ment. The technology supports operating  
system-absent manageability and down-  
the-wire security even when the system is  
powered off, the operating system is unre-  
sponsive, or software agents are disabled.  
While incorporating advanced technology,  
these processors remain software-compat-  
ible with previous IA-32 processors.  
on-board real estate.  
These processors offer quad-core and  
dual-core capabilities with performance  
and thermal design power (TDP) options  
ranging from 17 W to 45 W. Processors in  
the BGA package support error correcting  
code (ECC) memory.1 When paired with  
either the Mobile Intel® HM76 or Mobile  
Intel® QM77 Express chipset, this platform  
offers faster connectivity with integrated  
next-generation I/O technologies such as  
PCI Express* Gen 3.0 and USB 3.0. Intel®  
Rapid Start Technology2 provides increased  
system responsiveness, while support for  
DDR3L memory improves power efficiency.  
This 3rd generation Intel Core processor  
family and Intel® 7 Series chipsets are  
pin and package compatible with the 2nd  
generation Intel Core processor family  
and Intel® 6 Series chipsets, allowing  
developers to mix and match processors  
and chipsets to better suit their design  
needs. Developers can create one board  
design and scale a product line, using the  
same sockets to help cut design costs and  
accelerate time-to-market.  
Next-generation Intel® graphics engines  
significantly improve graphics and media  
performance compared to 2nd genera-  
tion Intel Core processor-based platforms.  
This platform supports three independent  

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