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AU14007-H1B-4N PDF预览

AU14007-H1B-4N

更新时间: 2024-11-12 03:00:35
品牌 Logo 应用领域
富士康 - FOXCONN /
页数 文件大小 规格书
1页 127K
描述
Card Edge Connector, 240 Contact(s), 2 Row(s), Female, 25 Degree, Solder Terminal

AU14007-H1B-4N 数据手册

  
SPECIFICATIONS  
DDR II Connector  
AU140 Series  
Mechanical  
25Degree, T/H Type  
1.00mm [.039”] Pitch  
240 Pos.  
Contact Retention Force: 0.75Lbs (0.34kgf) min. per Contact  
Durability: 25 Cycles  
Dram Board Insertion Force: 3 oz max. per Contact  
Electrical  
Voltage Raging: 250V AC  
Current Rating: 1.0A max., 30max., in Temperature Rise  
Insulation Resistance: 1000MW min. initial  
Dielectric Withstanding Voltage: 500V AC at Sea Level  
Low Level Contact Resistance: 30mW max. initial  
Physical  
Housing: Thermoplastic, UL 94V-0 rated in Black Color  
Contact: Copper alloy  
Ejector: Thermoplastic, UL 94V-0 rated in Ivory or Natural Color  
Metal Hold Down: Copper alloy  
Operating Temperature: -55to +105℃  
DRAWING  
ORDERING INFORMATION  
PRODUCT NO.: A U 1 4 0 * * - H 1 B- * *  
Memory Socket  
Slanted type  
PLATING TYPE  
4N=TIN/LEAD  
4F=LEAD FREE  
DDR II DIMM  
1.00mm Pitch  
Extension Code  
No. of Pos.  
40=240 Pos.  
Contact Area Plating  
1=Gold Flash  
2=20u" Gold  
Tail Length  
0=3.15 [.124]  
1=2.67 [.105]  
3=30u" Gold  
6=10u" Gold  
7=15u" Gold  
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.  

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