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ATSAM4SD16BA-MU PDF预览

ATSAM4SD16BA-MU

更新时间： 2024-11-25 12:23:43
品牌 Logo 应用领域
爱特美尔 - ATMEL 闪存微控制器
页数 文件大小 规格书
67页 638K
描述
ARM-based Flash MCU

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中文翻译

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ATSAM4SD16BA-MU 技术参数

是否Rohs认证： 符合生命周期：Transferred
包装说明：HVQCCN, LCC64,.35SQ,20Reach Compliance Code：compliant
ECCN代码：3A991.A.2HTS代码：8542.31.00.01
Factory Lead Time：1 week风险等级：5.66
具有ADC：YES地址总线宽度：
位大小：32CPU系列：CORTEX-M4
最大时钟频率：50 MHzDAC 通道：YES
DMA 通道：YES外部数据总线宽度：
JESD-30 代码：S-XQCC-N64长度：9 mm
I/O 线路数量：47端子数量：64
片上程序ROM宽度：8最高工作温度：85 °C
最低工作温度：-40 °CPWM 通道：YES
封装主体材料：UNSPECIFIED封装代码：HVQCCN
封装等效代码：LCC64,.35SQ,20封装形状：SQUARE
封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE电源：1.2 V
认证状态：Not QualifiedRAM（字节）：163840
ROM（单词）：1048576ROM可编程性：FLASH
座面最大高度：0.9 mm速度：120 MHz
子类别：Microcontrollers最大压摆率：25 mA
最大供电电压：1.32 V最小供电电压：1.08 V
标称供电电压：1.2 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子形式：NO LEAD端子节距：0.5 mm
端子位置：QUAD宽度：9 mm
uPs/uCs/外围集成电路类型：MICROCONTROLLER, RISC

ATSAM4SD16BA-MU 数据手册

 浏览型号ATSAM4SD16BA-MU的Datasheet PDF文件第2页浏览型号ATSAM4SD16BA-MU的Datasheet PDF文件第3页浏览型号ATSAM4SD16BA-MU的Datasheet PDF文件第4页浏览型号ATSAM4SD16BA-MU的Datasheet PDF文件第5页浏览型号ATSAM4SD16BA-MU的Datasheet PDF文件第6页浏览型号ATSAM4SD16BA-MU的Datasheet PDF文件第7页 
Features  
• Core  
– ARM® Cortex®-M4 with a 2Kbytes cache running at up to 120 MHz  
– Memory Protection Unit (MPU)  
– DSP Instruction Set  
– Thumb®-2 instruction set  
• Pin-to-pin compatible with SAM3N, SAM3S products (64- and 100- pin versions) and  
SAM7S legacy products (64-pin version)  
• Memories  
– Up to 2048 Kbytes embedded Flash with optional dual bank and cache memory  
– Up to 160 Kbytes embedded SRAM  
– 16 Kbytes ROM with embedded boot loader routines (UART, USB) and IAP routines  
– 8-bit Static Memory Controller (SMC): SRAM, PSRAM, NOR and NAND Flash support  
• System  
AT91SAM  
ARM-based  
Flash MCU  
– Embedded voltage regulator for single supply operation  
– Power-on-Reset (POR), Brown-out Detector (BOD) and Watchdog for safe operation  
– Quartz or ceramic resonator oscillators: 3 to 20 MHz main power with Failure  
Detection and optional low-power 32.768 kHz for RTC or device clock  
– RTC with Gregorian and Persian Calendar mode, waveform generation in low-  
power modes  
– RTC clock calibration circuitry for 32.768 kHz crystal frequency compensation  
– High precision 8/12 MHz factory trimmed internal RC oscillator with 4 MHz default  
frequency for device startup. In-application trimming access for frequency  
adjustment  
SAM4S Series  
– Slow Clock Internal RC oscillator as permanent low-power mode device clock  
– Two PLLs up to 240 MHz for device clock and for USB  
– Temperature Sensor  
– Up to 22 Peripheral DMA (PDC) Channels  
• Low Power Modes  
Preliminary  
Summary  
– Sleep and Backup Modes, down to 1 µA in Backup Mode  
– Ultra low-power RTC  
• Peripherals  
– USB 2.0 Device: 12 Mbps, 2668 byte FIFO, up to 8 bidirectional Endpoints. On-Chip  
Transceiver  
– Up to 2 USARTs with ISO7816, IrDA®, RS-485, SPI, Manchester and Modem Mode  
– Two 2-wire UARTs  
– Up to 2 Two Wire Interface (I2C compatible), 1 SPI, 1 Serial Synchronous Controller  
(I2S), 1 High Speed Multimedia Card Interface (SDIO/SD Card/MMC)  
– 2 Three-Channel 16-bit Timer/Counter with capture, waveform, compare and PWM  
mode. Quadrature Decoder Logic and 2-bit Gray Up/Down Counter for Stepper  
Motor  
– 4-channel 16-bit PWM with Complementary Output, Fault Input, 12-bit Dead Time  
Generator Counter for Motor Control  
– 32-bit Real-time Timer and RTC with calendar and alarm features  
– Up to 16-channel, 1Msps ADC with differential input mode and programmable gain  
stage and auto calibration  
– One 2-channel 12-bit 1Msps DAC  
– One Analog Comparator with flexible input selection, Selectable input hysteresis  
– 32-bit Cyclic Redundancy Check Calculation Unit (CRCCU)  
– Write Protected Registers  
• I/O  
– Up to 79 I/O lines with external interrupt capability (edge or level sensitivity),  
debouncing, glitch filtering and on-die Series Resistor Termination  
– Three 32-bit Parallel Input/Output Controllers, Peripheral DMA assisted Parallel  
Capture Mode  
NOTE: This is a summary document.  
The complete document is currently not  
available. For more information, please  
contact your local Atmel sales office.  
• Packages  
– 100-lead LQFP, 14 x 14 mm, pitch 0.5 mm/ 100-ball TFBGA, 9 x 9 mm, pitch 0.8 mm/  
100-ball VFBGA, 7 x 7 mm, pitch 0.65 mm  
– 64-lead LQFP, 10 x 10 mm, pitch 0.5 mm/ 64-pad QFN 9x9 mm, pitch 0.5 mm  
11100BS–ATARM–31-Jul-12  
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