Datasheet > ATS-54290D-C2-R0

ATS-54290D-C2-R0

更新时间： 2024-11-08 06:38:39

品牌	Logo	应用领域
ATS		/
页数	文件大小	规格书
1页	272K
描述
High Performance BGA Cooling

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数据手册

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ATS-54290D-C2-R0 数据手册

High Performance BGA Cooling

Solutions w/ Thermal Tape Attachment

ATS PART # ATS-54290D-C2-R0

Features & Beneﬁts

High aspect ratio, straight fin heat sinks that are ideal for

compact PCB environments

Designed specifically for BꢀAs and other surface mount

packages

Comes preassembled with high performance thermal

interface material

ꢁhermal Performance

*Image above is for illustration purposes only.

AIR VELOCITy

THERMAL RESISTANCE

FT/MIN

200

M/S

1.0

1.5

2.0

2.5

3.0

3.5

4.0

°C/W (UNDUCTED FLOW)

°C/W (DUCTED FLOW)

13.1

10.2

8.8

6.7

300

400

500

7.8

600

7.1

700

6.6

800

6.2

Product Details

INTERFACE MATERIAL

SAINT-ꢀOBAIN C675

BLACK-ANODIZED

DIMENSION A

29 mm

DIMENSION B

DIMENSION C

DIMENSION D

FINISH

29 mm

9.5 mm

29 mm

Nꢀꢁꢂꢃ:

Dimension C = heat sink height from bottom of the base to the top of the ﬁn ﬁeld.

Thermal performance data are provided for reference only. Actual performance may vary

by application.

ATS reserves the right to update or change its products without notice to improve the

design or performance.

Contact ATS to learn about custom options available.

For more information, to ﬁnd a distributor or to place an order, visit www.qats.com or

call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).

REV1_0908

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