Datasheet > ATS-50425P-C2-R0

ATS-50425P-C2-R0

更新时间： 2024-11-09 08:40:03

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描述
Ultra High Performance BGA Cooling

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ATS-50425P-C2-R0 数据手册

Ultra High Performance BGA Cooling

Solutions w/ maxiGRIP™ Attachment

ATS PART # ATS-50425P-C2-R0

Features & Beneﬁts

maxiFLOW™ design features a low profile, spread fin

array that maximizes surface area for more effective

convection (air) cooling

maxiGRIP™ attachment applies steady, even pressure to

the component and does not require holes in the PCB

Meets Telcordia GR-63-Core Office Vibration; ETSI 300

019 Transportation Vibration; and MIL-STD-810 Shock and

Unpackaged Drop Testing standards

Comes preassembled with high performance thermal

interface material

Designed for standard height components from 3 to 4.5mm

ꢁhermal Performance

*Image above is for illustration purposes only.

AIR VELOCITy

THERMAL RESISTANCE

FT/MIN

200

M/S

1.0

1.5

2.0

2.5

3.0

3.5

4.0

°C/W (UNDUCTED FLOW)

°C/W (DUCTED FLOW)

1.5

1.9

1.5

1.3

1.2

1.1

300

400

500

600

700

800

Product Details

INTERFACE MATERIAL

SAINT-GOBAIN C675

DIMENSION A

42.5 mm

DIMENSION B

DIMENSION C

DIMENSION D

FINISH

42.5 mm

17.5 mm

72.9 mm

BLUE-ANODIZED

Nꢀꢁꢂꢃ:

Dimension C = heat sink height from bottom of the base to the top of the ﬁn ﬁeld.

Thermal performance data are provided for reference only. Actual performance may vary

by application.

ATS reserves the right to update or change its products without notice to improve the

design or performance.

Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT425

Contact ATS to learn about custom options available.

For more information, to ﬁnd a distributor or to place an order, visit www.qats.com or

call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).

REV1_0908

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