Datasheet > AT25SF161-DWF

AT25SF161-DWF

更新时间： 2024-10-29 02:48:51

品牌	Logo	应用领域
其他 - ETC		时钟内存集成电路
页数	文件大小	规格书
49页	3392K
描述
16-Mbit, 2.5V Minimum SPI Serial Flash Memory with Dual-I/O and Quad-IO Support

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AT25SF161-DWF 数据手册

AT25SF161

16-Mbit, 2.5V Minimum

SPI Serial Flash Memory with Dual-I/O and Quad-IO Support

Features



Single 2.5V - 3.6V Supply

Serial Peripheral Interface (SPI) Compatible

 Supports SPI Modes 0 and 3

 Supports Dual and Quad Output Read



104MHz Maximum Operating Frequency

 Clock-to-Output (t_V) of 6 ns

Flexible, Optimized Erase Architecture for Code + Data Storage Applications

 Uniform 4-Kbyte Block Erase

 Uniform 32-Kbyte Block Erase

 Uniform 64-Kbyte Block Erase



Full Chip Erase

Hardware Controlled Locking of Protected Blocks via WP Pin

3 Protected Programmable Security Register Pages

Flexible Programming

 Byte/Page Program (1 to 256 Bytes)

Fast Program and Erase Times



 0.7ms Typical Page Program (256 Bytes) Time

 70ms Typical 4-Kbyte Block Erase Time

 300ms Typical 32-Kbyte Block Erase Time

 600ms Typical 64-Kbyte Block Erase Time



JEDEC Standard Manufacturer and Device ID Read Methodology

Low Power Dissipation

 2µA Deep Power-Down Current (Typical)

 10µA Standby current (Typical)

 4mA Active Read Current (Typical)



Endurance: 100,000 Program/Erase Cycles

Data Retention: 20 Years

Complies with Full Industrial Temperature Range

Industry Standard Green (Pb/Halide-free/RoHS Compliant) Package Options

 8-lead SOIC (150-mil and 208-mil)

 8-pad Ultra Thin DFN (5 x 6 x 0.6 mm)

 Die in Wafer Form

 Hi-Rel Plastic Available

 8-ball die Ball Grid Array (dBGA - WLCSP)

DS-25SF161–046H–8/2017

12 3 4 5 6 7...49

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