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AT1140DN-5.0TRG1 PDF预览

AT1140DN-5.0TRG1

更新时间: 2024-10-29 12:26:51
品牌 Logo 应用领域
BCDSEMI 电视
页数 文件大小 规格书
7页 382K
描述
General Purpose ITVS, 4 I/Os, CI/O-VSS<0.65pF

AT1140DN-5.0TRG1 数据手册

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Data Sheet  
General Purpose ITVS, 4 I/Os, CI/O-VSS<0.65pF  
AT1140  
Features  
General Description  
Clamping Voltage: 11.5V at 20A 100ns, TLP  
10.5V at 6A 8μs/20μs  
IEC 61000-4-2: +24kV, -18kV (Air)  
IEC 61000-4-2: +20kV, -16kV (Contact)  
IEC 61000-4-5 (Lightning, 8μs/20μs): ±6A  
Input Capacitance From I/O to VSS: 0.5pF  
TLP Dynamic Resistance: 0.25  
BCD ITVS (Integrated Transient Voltage Suppression)  
devices are designed and built using BCD proprietary  
process technology. These devices integrate the  
various diodes, transistors and resistors into the BCD  
ITVS products. These diodes and transistors feature  
low parasitic resistance and the diodes also exhibit  
low capacitance. Using these devices, BCD is able to  
design voltage clamping products where low  
capacitance associated with low dynamic resistance is  
required.  
Monolithic Silicon Technology  
Applications  
The BCD AT1140 is a general purpose, high  
performance device suitable for protecting four high  
speed I/Os. These devices are assembled in DFN  
packages for operation at higher frequencies  
minimizing distortion to the lines being protected.  
DVI  
Ethernet Port: 10/100/1000 Mb/s  
HDMI 1.3, High Definition Multi Media  
IEEE 1394 to 3.2Gb/s  
MDDI  
PCI Express  
SATA /eSATA  
The AT1140 is available in the DFN-2.5×1.0-10  
package. This package allows simple and optimal  
placement in existing high-speed PCB layouts.  
USB 2.0 to 480 MHz  
Pin Configuration  
DN Package  
(DFN-2.5×1.0-10)  
Figure 1. Pin Configuration of AT1140 (Top View)  
Aug. 2012 Rev. 1.2  
BCD Semiconductor Manufacturing Limited  
1

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