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AS7C33256PFD36A-166TQI PDF预览

AS7C33256PFD36A-166TQI

更新时间: 2024-02-14 10:36:27
品牌 Logo 应用领域
ALSC 内存集成电路静态存储器
页数 文件大小 规格书
20页 527K
描述
3.3V 256K x 32/36 pipelined burst synchronous SRAM

AS7C33256PFD36A-166TQI 技术参数

是否Rohs认证: 不符合生命周期:Transferred
零件包装代码:QFP包装说明:LQFP, QFP100,.63X.87
针数:100Reach Compliance Code:unknown
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.37最长访问时间:3.5 ns
其他特性:FLOW-THROUGH OR PIPELINED ARCHITECTUREI/O 类型:COMMON
JESD-30 代码:R-PQFP-G100JESD-609代码:e0
长度:20 mm内存密度:9437184 bit
内存集成电路类型:STANDARD SRAM内存宽度:36
功能数量:1端子数量:100
字数:262144 words字数代码:256000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:256KX36
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装等效代码:QFP100,.63X.87
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5/3.3,3.3 V认证状态:Not Qualified
座面最大高度:1.6 mm最大待机电流:0.03 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.475 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

AS7C33256PFD36A-166TQI 数据手册

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AS7C33256PFD32A  
AS7C33256PFD36A  
®
Signal descriptions  
Signal  
I/O Properties Description  
CLK  
I
I
CLOCK  
SYNC  
SYNC  
Clock. All inputs except OE, ZZ, LBO are synchronous to this clock.  
Address. Sampled when all chip enables are active and ADSC or ADSP are asserted.  
Data. Driven as output when the chip is enabled and OE is active.  
A, A0, A1  
DQ[a,b,c,d] I/O  
Master chip enable. Sampled on clock edges when ADSP or ADSC is active. When CE0  
is inactive, ADSP is blocked. Refer to the Synchronous Truth Table for more  
information.  
CE0  
I
SYNC  
Synchronous chip enables. Active HIGH and active LOW, respectively. Sampled on  
clock edges when ADSC is active or when CE0 and ADSP are active.  
CE1, CE2  
ADSP  
I
I
SYNC  
SYNC  
Address strobe processor. Asserted LOW to load a new bus address or to enter standby  
mode.  
Address strobe controller. Asserted LOW to load a new address or to enter standby  
mode.  
ADSC  
ADV  
GWE  
I
I
I
SYNC  
SYNC  
SYNC  
Advance. Asserted LOW to continue burst read/write.  
Global write enable. Asserted LOW to write all 32/36 bits. When HIGH, BWE and  
BW[a:d] control write enable.  
Byte write enable. Asserted LOW with GWE = HIGH to enable effect of BW[a:d]  
inputs.  
BWE  
I
SYNC  
SYNC  
Write enables. Used to control write of individual bytes when GWE = HIGH and BWE =  
LOW. If any of BW[a:d] is active with GWE = HIGH and BWE = LOW the cycle is a  
write cycle. If all BW[a:d] are inactive the cycle is a read cycle.  
BW[a,b,c,d] I  
Asynchronous output enable. I/O pins are driven when OE is active and the chip is in  
read mode.  
OE  
I
I
ASYNC  
STATIC  
Selects Burst mode. When tied to V or left floating, device follows Interleaved Burst  
DD  
LBO  
order. When driven Low, device follows linear Burst order. This signal is internally  
pulled High.  
ZZ  
I
-
ASYNC  
-
Snooze. Places device in LOW power mode; data is retained. Connect to GND if unused.  
No connect  
NC  
Snooze Mode  
SNOOZE MODE is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of  
SNOOZE MODE is dictated by the length of time the ZZ is in a High state.  
The ZZ pin is an asynchronous, active high input that causes the device to enter SNOOZE MODE.  
When the ZZ pin becomes a logic High, ISB2 is guaranteed after the time tZZI is met. After entering SNOOZE MODE, all inputs except ZZ  
is disabled and all outputs go to High-Z. Any operation pending when entering SNOOZE MODE is not guaranteed to successfully complete.  
Therefore, SNOOZE MODE (READ or WRITE) must not be initiated until valid pending operations are completed. Similarly, when exiting  
SNOOZE MODE during tPUS, only a DESELECT or READ cycle should be given while the SRAM is transitioning out of SNOOZE  
MODE.  
12/1/04, v.1.2  
Alliance Semiconductor  
P. 5 of 20  

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