生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 381 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.32 | 其他特性: | IT CAN ALSO WORK AT 5V SUPPLY |
JESD-30 代码: | S-PBGA-B381 | 长度: | 31 mm |
端子数量: | 381 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 认证状态: | Not Qualified |
最大供电电压: | 3.6 V | 最小供电电压: | 3 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 宽度: | 31 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
AS3SSD4GB8PBG | AUSTIN |
获取价格 |
Solid State Disk On Chip (SSDoC) | |
AS3SSD4GB8PBG/CT | MICROSS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA381, 31 X 31 MM, PACKAGE-381 | |
AS3SSD4GB8PBG/IT | MICROSS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA381, 31 X 31 MM, PACKAGE-381 | |
AS3SSD4GB8PBGR/CT | AUSTIN |
获取价格 |
Solid State Disk On Chip (SSDoC) | |
AS3SSD4GB8PBGR/CT | MICROSS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA381, 31 X 31 MM, ROHS COMPLIANT PACKAGE-381 | |
AS3SSD4GB8PBGR/IT | AUSTIN |
获取价格 |
Solid State Disk On Chip (SSDoC) | |
AS3SSD4GB8PBGR/IT | MICROSS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA381, 31 X 31 MM, ROHS COMPLIANT PACKAGE-381 | |
AS3SSD8GB8PBG | AUSTIN |
获取价格 |
Solid State Disk On Chip (SSDoC) | |
AS3SSD8GB8PBG/CT | MICROSS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA381, 31 X 31 MM, PACKAGE-381 | |
AS3SSD8GB8PBG/IT | MICROSS |
获取价格 |
Microprocessor Circuit, CMOS, PBGA381, 31 X 31 MM, PACKAGE-381 |