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AS3SSD16GB5PBGR/IT PDF预览

AS3SSD16GB5PBGR/IT

更新时间: 2024-01-08 05:13:37
品牌 Logo 应用领域
AUSTIN /
页数 文件大小 规格书
17页 757K
描述
Solid State Disk On Chip (SSDoC)

AS3SSD16GB5PBGR/IT 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:BGA,针数:381
Reach Compliance Code:compliantHTS代码:8542.31.00.01
风险等级:5.32其他特性:IT CAN ALSO WORK AT 5V SUPPLY
JESD-30 代码:S-PBGA-B381长度:31 mm
端子数量:381最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:SQUARE
封装形式:GRID ARRAY认证状态:Not Qualified
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM宽度:31 mm
uPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT

AS3SSD16GB5PBGR/IT 数据手册

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MICONDUCTOR, INC.  
                                                                   
                                                                   
                                                                     
                                                                     
                                                                       
                                                                       
                                                                           
                                                                           
                                                                             
                                                                             
                                                                               
                                                                               
                                                                                 
                                                                                 
SOLID STATE DISK  
AS3SSD4GB8PBG  
AS3SSD8GB8PBG  
AS3SSD16GB5PBG  
PRELIMINARY  
Austin Semiconductor, Inc.  
BLOCK DIAGRAM  
16 Gb  
Dual  
16 Gb  
Dual  
16 Gb  
Dual  
16 Gb  
Dual  
enable  
NAND  
enable  
NAND  
enable  
NAND  
enable  
NAND  
Controller  
16 Gb  
Dual  
16 Gb  
Dual  
16 Gb  
Dual  
16 Gb  
Dual  
enable  
NAND  
enable  
NAND  
enable  
NAND  
enable  
NAND  
IDE Interface  
REGULATORY COMPLIANCE  
Since the PATA SSD is a component (or a set of components depending on the configuration) on the  
motherboard, system certifications are the responsibility of the OEM or ODM.  
DEVICE COMPLIANCE  
Compliance  
PB Free  
RoHS  
Description  
Components and materials are lead free.  
Restriction of Hazardous Substance Directive  
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.  
AS3SSD4GB8PBG,AS3SSD8GB8PBG,AS3SSD16GB5PBG  
Rev. 1.3 07/09  
3

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