FLASH
AS29F040
TM
512K x 8 FLASH
UNIFORM SECTOR 5.0V FLASH MEMORY
SPECIFICATIONS
PIN ASSIGNMENT
(Top View)
Military Equivalent Screening - 883 1.2.2
32-PIN Ceramic DIP (CW)
32-pin Flatpack (F)
32-pin Lead Formed Flatpack (DCG)
FEATURES
•
•
•
Single 5.0V ±10% power supply operation
Fastest access times: 55, 60, 70, 90, 120 & 150ns
Low power consumption:
A18
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
VCC
WE\
A17
A14
32
31
30
29
1
2
3
4
20 mA typical active read current
30 mA typical program/erase current
1 µA typical standby current (standard access time to
active mode)
28 A13
5
27
26
25
24
23
22
21
A8
A9
6
7
8
9
10
11
12
13
14
15
16
A11
OE\
A10
CE\
DQ7
•
Flexible sector architecture
Eight uniform 64 Kbyte each
Any combination of sectors can be erased
Supports full chip erase
20 DQ6
•
•
•
•
Sector protection
Embedded Algorithms Erase & Program Algorithms
Erase Suspend/Resume
Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
19
18
17
DQ5
DQ4
DQ3
32-PAD Ceramic LCC (ECA)
•
Compatible with JEDEC standards
Pinout and software compatible with single-power-
supply FLASH
•
•
Data \ Polling and Toggle Bits
20-year data retention at 125°C
4 3 2
32 31 30
5
6
7
8
9
A7
A6
A5
1
29
A14
A13
A8
28
27
26
25
24
23
22
21
A4
A9
A3
A11
OE\
A10
CE\
I/O 7
10
11
12
13
A2
A1
A0
I/O0
14 15 16 17 18 19 20
OPTIONS
Timing
55ns
60ns
70ns
MARKING
OPTIONS
MARKING
Package Type
Ceramic DIP (600 mil)
Flatpack
Lead Formed Flatpack
Leadless Chip Carrier
CW
F
DCG
ECA
-55
-60
-70
-90
90ns
120ns
150ns
-120
-150
Temperature Ranges
Industrial Temperature (-40°C to +85°C)
IT
Military Temperature (-55°C to +125°C) XT**
Military Equivalent Screening - 883 1.2.2
MIL
For more products and information;
(-55°C to +125°C)
please visit our web site at
www.micross.com
Micross Components reserves the right to change products or specifications without notice.
AS29F040 • Rev. 3.1 07/19
1