FLASH
AS29F040
Austin Semiconductor, Inc.
PIN ASSIGNMENT
512K x 8 FLASH
(TopView)
32-PIN Ceramic DIP (CW)
32-pin Flatpack (F)
UNIFORM SECTOR 5.0V FLASH MEMORY
AVAILABLE AS MILITARY
SPECIFICATIONS
• MIL-STD-883
32-pin Lead Formed Flatpack (DCG)
A18
A16
A15
A12
A7
A6
A5
A4
A3
VCC
WE\
A17
A14
32
31
30
29
1
2
3
4
• SMD 5962-96692
28 A13
27 A8
5
6
FEATURES
• Single 5.0V ±10% power supply operation
• Fastest access times: 55, 60, 70, 90, 120, & 150ns
• Low power consumption:
26
25
24
A9
A11
OE\
7
8
9
3 20 mA typical active read current
3 30 mA typical program/erase current
3 1 µA typical standby current (standard access time to
active mode)
• Flexible sector architecture
3 Eight uniform 64 Kbyte each
A2
A1
A0
DQ0
DQ1
DQ2
VSS
23 A10
10
11
12
13
14
15
16
22
21
CE\
DQ7
20 DQ6
19 DQ5
18
17
DQ4
DQ3
3 Any combination of sectors can be erased
3 Supports full chip erase
• Sector protection
32-PAD Ceramic LCC (ECA)
• EmbeddedAlgorithms Erase & ProgramAlgorithms
• Erase Suspend/Resume
• Minimum 1,000,000 Program/Erase Cycles per sector
4
3
2
32 31 30
29
5
6
7
8
9
A7
A6
A5
A14
A13
A8
1
28
27
26
25
24
23
22
21
guaranteed
• Compatible with JEDEC standards
3 Pinout and software compatible with single-power-
supply FLASH
• Data\ Polling and Toggle Bits
• 20-year data retention at 125°C
A4
A9
A3
A11
OE\
A10
CE\
I/O 7
10
11
12
13
A2
A1
A0
I/O0
14 15 16 17 18 19 20
OPTIONS
• Package Type
MARKING
Ceramic DIP (600 mil)
Flatpack
Lead Formed Flatpack
Leadless Chip Carrier
CW
F
DCG
ECA
OPTIONS
• Timing
55ns
MARKING
-55
-60
60ns
70ns
90ns
120ns
150ns
-70
-90
-120
-150
• Temperature Ranges
Industrial Temperature (-40°C to +85°C) IT
Military Temperature (-55°C to +125°C) XT**
883C Processing (-55°C to +125°C)
QML Processing (-55°C to +125°C)
883C
Q
For more products and information
please visit our web site at
www.austinsemiconductor.com
AS29F040
AustinSemiconductor,Inc.reservestherighttochangeproductsorspecificationswithoutnotice.
Rev. 2.2 09/07
1