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AS25J1R00ET PDF预览

AS25J1R00ET

更新时间: 2024-11-11 00:54:51
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2页 646K
描述
Reduction of assembly costs

AS25J1R00ET 数据手册

 浏览型号AS25J1R00ET的Datasheet PDF文件第2页 
AS Series  
Anti-surge Thick Film Chip Resistors  
F ꢀ At u ꢁ ꢀ S  
•ꢀSmallꢀsizeꢀandꢀlightꢀweight  
•ꢀSuitableꢀforꢀbothꢀwaveꢀandꢀreflowꢀsoldering  
•ꢀCanꢀwithstandꢀhighꢀsurge  
•ꢀReductionꢀofꢀassemblyꢀcosts  
SꢀꢁꢂꢀS SpꢀcꢂFꢂcAtꢂonS  
Power  
Rating  
at 70°C  
0.33W  
0.5W  
Max  
Working  
Voltage  
150V  
200V  
500V  
Max  
Overload  
Voltage  
300V  
400V  
500V  
Dielectric  
Withstanding  
Voltage  
500V  
Resistance  
Range  
1Ω~10MΩ  
1Ω~10MΩ  
1Ω~20MΩ  
Type  
AS08 (0805)  
AS12 (1206)  
AS25 (2512)  
500V  
500V  
1.5W  
chAꢁActꢀꢁꢂStꢂcS  
-55°C ~ +155°C  
Std. Oper. Temp.  
Standard Values  
Construction  
Tolerance  
Test  
ΔR  
Test Methods (JIS C 5201-1 )  
E-24 values  
Thick film  
1Ω-10Ω: ≤ ±400PPM/°C  
(±200 PPM can be provid- R2-R1  
ed on a case to case basis)  
11Ω-10MΩ: ≤ ±100PPM/°C  
Natural ΔR/°C  
Temperature  
Coefficient  
x 106 (PPM/°C)  
R1(t2-t1)  
±5% standard; ±10%  
and ±20% available  
R1: at room temp. (T1)  
R2: at room temp. plus 100°C (T2)  
Test pattern: room temp. (T1), room  
temp. +100°C(T2)  
Derating  
100  
80  
60  
40  
20  
0
±(1.0% + 0.1Ω) max.  
±(1.0% + 0.05Ω) max.  
Permanent ΔR after the application of a  
potential of 2.5 times RCWV for 5 sec.  
Short Time  
Overload  
Twist of Test Board: Y/X = 3/90 mm for  
60 sec.  
Terminal  
Bending  
±(1.0% + 0.05Ω) max.  
±(1.0% + 0.1Ω) max.  
±(3.0% + 0.1Ω) max.  
260°C±3°C for 10 ±1 sec.  
See graph on next page.  
Soldering Heat  
Single Pulse  
Humidity  
Temporary ΔR after 240 hr. at 40 ±2°C  
and 90-95% relative humidity  
-55  
0
50 70 100  
155  
Ambient Temperature, °C  
±(3.0% + 0.1Ω) max.  
±(3.0% + 0.1Ω) max.  
ΔR after 1,000 hr. (1.5 hr. "on", 0.5 hr.  
"off" ) at RCWV at 40 ±2°C and 90-95%  
relative humidity  
Load Life in  
Humidity  
Reflow  
300  
250  
200  
150  
100  
50  
ΔR change after 1,000 hr. operat-  
ing at RCWV, with duty cycle of (1.5  
hours"on", 0.5 hour"off") at 70°C ±2°C  
ambient  
Load Life  
Soldering230° ~ 245°/250°  
20 ±10sec.  
Preheating  
150° ~ 180°  
90 ±30sec.  
Cooling  
Min. 95% coverage  
Wave Solder: 245°C ±3°C for 2-3 sec.  
Solderability  
±(1.0% + 0.05Ω) max.  
ΔR after 5 cycles:  
-55°C ±3°C 30 min.  
Room temp. 10-15 min.  
+155°C ±2°C 30 min.  
4 Room temp. 10-15 min.  
Temperature  
Cycling  
0
No evidence of flashover,  
mechanical damage, arcing lic v-block at specified AC potential  
or insulation breakdown 60-70 sec.  
Clamped in the trough of a 90°C metal-  
Dielectric  
withstanding  
voltage  
Time  
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com  
6

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