AS1160/AS1161
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated in Electrical Character-
istics on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 3. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments
AVDD, DVDD
-0.3
+4
V
VDD +
0.3
LVCMOS/LVTTL Input
LVCMOS/LVTTL Output
-0.3
V
V
VDD +
0.3
-0.3
-0.3
Bus LVDS Receiver Input/Output
Bus LVDS Output Short-Circuit Duration
Power Dissipation
+3.9
10
V
ms
W
1.47
85
Derate at 11.8mW/ºC above 25ºC
θJA
ºC/W
kV
ESD
2
HBM MIL-Std. 883E 3015.7 methods;
Operating Temperature
Storage Temperature
Junction Temperature
-40
-65
+85
+150
+150
ºC
ºC
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with
IPC/JEDEC J-STD-020D “Moisture/Reflow
Sensitivity Classification for Non-Hermetic
Solid State Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Package Body Temperature
+260
ºC
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