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AS1155 PDF预览

AS1155

更新时间: 2024-11-07 06:37:39
品牌 Logo 应用领域
艾迈斯 - AMSCO /
页数 文件大小 规格书
15页 291K
描述
Single/Dual LVDS Receivers

AS1155 数据手册

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Data Sheet  
AS1153/55/57/58  
Single/Dual LVDS Receivers  
1 General Description  
2 Key Features  
The AS1153/55/57/58 are Single/Dual flow-through  
LVDS (low-voltage differential signaling) receivers which  
accept LVDS differential inputs and convert them to  
LVCMOS outputs. The receivers are perfect for low-  
power low-noise applications requiring high signaling  
rates and reduced EMI emissions.  
Flow-Through Pinout  
Guaranteed 260Mbps Data Rate  
300ps Pulse Skew (Max)  
Conform to ANSI TIA/EIA-644 LVDS Standards  
Single +3.3V Supply  
The devices are guaranteed to receive data at speeds  
up to 260Mbps (130MHz) over controlled impedance  
media of approximately 100Ω. Supported transmission  
media are PCB traces, backplanes, and cables.  
Operating Temperature Range: -40 to +85ºC  
Failsafe Circuit  
The AS1155/58 are single LVDS receivers, and the  
AS1153/57 are dual LVDS receivers.  
The AS1157/58 features integrated parallel termination  
resistors (nominally 107Ω), which eliminate the require-  
ment for discrete termination resistors, and reduce stub  
lengths. The AS1153/55 uses high impedance inputs  
and requires an external termination resistor when used  
in a point-to-point connection.  
Integrated Termination (AS1157/58)  
8-pin SOIC Package  
3 Applications  
The integrated Failsafe feature sets the output high if the  
inputs are open, undriven and terminated, or undriven  
and shorted.  
Digital Copiers, Laser Printers, Cellular Phone Base Sta-  
tions, Add/Drop Muxes, Digital Cross-Connects,  
DSLAMs, Network Switches/Routers, Backplane Inter-  
connect, Clock Distribution Computers, Intelligent Instru-  
ments, Controllers, Critical Microprocessors and  
Microcontrollers, Power Monitoring, and Portable/Bat-  
tery-Powered Equipment.  
All inputs conform to the ANSI TIA/EIA- 644 LVDS stan-  
dards. Flow-through pinout simplifies PC board layout  
and reduces crosstalk by separating the LVDS inputs  
and LVCMOS outputs.  
The devices are available in a 8-pin SOIC package.  
Figure 1. Block Diagrams  
AS1155/58  
AS1153/57  
IN1-  
IN1-  
IN1+  
IN2+  
IN2-  
VCC  
VCC  
IN1+  
OUT1  
OUT1  
OUT2  
GND  
N/C  
N/C  
N/C  
GND  
www.austriamicrosystems.com  
Revision 1.01  
1 - 15  

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