ARE1-xxx0-00000 Data Sheet
High Power Infrared Emitting Diodes
Figure 8: Maximum Forward Current vs. Ambient
Temperature for ARE1-8xC0 and ARE1-9xD0
Figure 9: Maximum Forward Current vs. Ambient
Temperature for ARE1-8xD0
1200
1000
800
1200
1000
800
RșJ-A = 25°C/W
600
400
200
0
RșJ-A = 35°C/W
RșJ-A = 45°C/W
600
400
200
0
RșJ-A = 25°C/W
RșJ-A = 35°C/W
RșJ-A = 45°C/W
0
20
40
60
80
100
0
20
40
60
80
100
120
AMBIENT TEMPERATURE, TA - °C
AMBIENT TEMPERATURE, TA - °C
Figure 10: Maximum Forward Current vs. Ambient
Temperature for ARE1-8x30
Figure 11: Maximum Forward Current vs. Ambient
Temperature for ARE1-9x30
1200
1000
800
1200
1000
800
RșJ-A = 20°C/W
RșJ-A = 20°C/W
RșJ-A = 25°C/W
RșJ-A = 30°C/W
600
400
200
0
600
400
200
0
RșJ-A = 25°C/W
RșJ-A = 30°C/W
0
20
40
60
80
100
0
20
40
60
80
100
AMBIENT TEMPERATURE, TA - °C
AMBIENT TEMPERATURE, TA - °C
Figure 12: Maximum Forward Current vs. Solder Point
Temperature
Figure 13: Recommended Soldering Land Pattern
1.0
1200
1000
0.5
Others
800
ARE1-8x30
ARE1-8xD0
600
400
200
0
0
20
40
60
80
100
120
SOLDER POINT TEMPERATURE, TS - °C
NOTE: All dimensions are in millimeters (mm).
Broadcom
ARE1-xxx0-DS100
6