是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | MODULE |
包装说明: | MODULE-12 | 针数: | 12 |
Reach Compliance Code: | unknown | 风险等级: | 5.15 |
Is Samacsys: | N | 外壳连接: | ISOLATED |
最大集电极电流 (IC): | 75 A | 集电极-发射极最大电压: | 1700 V |
配置: | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR | 门极-发射极最大电压: | 20 V |
JESD-30 代码: | R-XUFM-X12 | JESD-609代码: | e0 |
元件数量: | 2 | 端子数量: | 12 |
最高工作温度: | 150 °C | 封装主体材料: | UNSPECIFIED |
封装形状: | RECTANGULAR | 封装形式: | FLANGE MOUNT |
峰值回流温度(摄氏度): | NOT SPECIFIED | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 312 W | 认证状态: | Not Qualified |
子类别: | Insulated Gate BIP Transistors | 表面贴装: | NO |
端子面层: | TIN LEAD | 端子形式: | UNSPECIFIED |
端子位置: | UPPER | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
晶体管应用: | POWER CONTROL | 晶体管元件材料: | SILICON |
标称断开时间 (toff): | 1100 ns | 标称接通时间 (ton): | 450 ns |
VCEsat-Max: | 2.4 V | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
APTGT50A170T1G | MICROSEMI |
获取价格 |
Phase leg Trench + Field Stop IGBT® Power Mod | |
APTGT50A170T1G-Module | MICROCHIP |
获取价格 |
Configuration: Phase legVCES (V): 1700VCESat (V): 2Current (A) Tc=80C: 50Silicon type: TRE | |
APTGT50A170TG | MICROSEMI |
获取价格 |
Phase leg Trench + Field Stop IGBT Power Module | |
APTGT50A170TG-Module | MICROCHIP |
获取价格 |
Configuration: Phase legVCES (V): 1700VCESat (V): 2Current (A) Tc=80C: 50Silicon type: TRE | |
APTGT50A60T1G | MICROSEMI |
获取价格 |
Phase leg Trench + Field Stop IGBT® Power Mod | |
APTGT50DA120D1 | ADPOW |
获取价格 |
Boost chopper Trench IGBT Power Module | |
APTGT50DA120D1 | MICROSEMI |
获取价格 |
Insulated Gate Bipolar Transistor, 75A I(C), 1200V V(BR)CES, N-Channel, MODULE-7 | |
APTGT50DA120D1G | MICROSEMI |
获取价格 |
Insulated Gate Bipolar Transistor, 75A I(C), 1200V V(BR)CES, N-Channel, MODULE-7 | |
APTGT50DA120TG | MICROSEMI |
获取价格 |
Boost chopper Fast Trench + Field Stop IGBT® | |
APTGT50DA120TG | ADPOW |
获取价格 |
Boost chopper Fast Trench + Field Stop IGBT Power Module |