是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | MODULE |
包装说明: | FLANGE MOUNT, R-XUFM-X25 | 针数: | 25 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
风险等级: | 1.47 | 外壳连接: | ISOLATED |
最大集电极电流 (IC): | 75 A | 集电极-发射极最大电压: | 600 V |
配置: | COMPLEX | 门极-发射极最大电压: | 20 V |
JESD-30 代码: | R-XUFM-X25 | JESD-609代码: | e1 |
元件数量: | 4 | 端子数量: | 25 |
最高工作温度: | 175 °C | 封装主体材料: | UNSPECIFIED |
封装形状: | RECTANGULAR | 封装形式: | FLANGE MOUNT |
峰值回流温度(摄氏度): | NOT SPECIFIED | 极性/信道类型: | N-CHANNEL |
最大功率耗散 (Abs): | 340 W | 认证状态: | Not Qualified |
子类别: | Insulated Gate BIP Transistors | 表面贴装: | NO |
端子面层: | TIN SILVER COPPER | 端子形式: | UNSPECIFIED |
端子位置: | UPPER | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
晶体管应用: | POWER CONTROL | 晶体管元件材料: | SILICON |
标称断开时间 (toff): | 370 ns | 标称接通时间 (ton): | 180 ns |
VCEsat-Max: | 1.9 V | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
APTGT100H60T3G-Module | MICROCHIP |
获取价格 |
Configuration: Full bridgeVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 100Silicon type: | |
APTGT100H60TG | MICROSEMI |
获取价格 |
Full - Bridge Trench + Field Stop IGBT Power Module | |
APTGT100H60TG-Module | MICROCHIP |
获取价格 |
Configuration: Full bridgeVCES (V): 600VCESat (V): 1.5Current (A) Tc=80C: 100Silicon type: | |
APTGT100SK120D1 | MICROSEMI |
获取价格 |
Insulated Gate Bipolar Transistor, 150A I(C), 1200V V(BR)CES, N-Channel, MODULE-7 | |
APTGT100SK120D1 | ADPOW |
获取价格 |
Buck chopper Trench IGBT Power Module | |
APTGT100SK120D1G | MICROSEMI |
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Buck chopper Trench + Field Stop IGBT Power Module | |
APTGT100SK120T | ADPOW |
获取价格 |
Buck chopper Fast Trench + Field Stop IGBT Power Module | |
APTGT100SK120TG | MICROSEMI |
获取价格 |
Buck chopper Fast Trench + Field Stop IGBT Power Module | |
APTGT100SK170D1 | ADPOW |
获取价格 |
Buck chopper Trench IGBT Power Module | |
APTGT100SK170D1G | MICROSEMI |
获取价格 |
Insulated Gate Bipolar Transistor |