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AP1212LNL-U

更新时间： 2024-02-15 04:03:15

品牌	Logo	应用领域
美台 - DIODES		开关电源开关
页数	文件大小	规格书
12页	278K
描述
Buffer/Inverter Based MOSFET Driver, 1A, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8

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技术参数
数据手册

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AP1212LNL-U 技术参数

生命周期：	Obsolete	包装说明：	,
Reach Compliance Code：	compliant	风险等级：	5.84
Base Number Matches：	1

AP1212LNL-U 数据手册

AP1212

DUAL USB HIGH-SIDE POWER SWITCH

Function Description

Error Flag

Supply Filtering

An open-drained output of N-channel MOSFET, the FLG

output is pulled low to signal the following fault conditions: input

undervoltage, output current limit, and thermal shutdown.

A 0.1µF to 1µF bypass capacitor from IN to GND, located

near the device, is strongly recommended to control supply

transients. Without a bypass capacitor, an output short may

cause sufficient ringing on the input (from supply lead inductance)

to damage internal control circuitry.

Current Limit

Transient Droop Requirements

The current limit threshold is preset internally. It protects

the output MOSFET switches from damage due to undesirable

short circuit conditions or excess inrush current often

encountered during hot plug-in. The low limit of the current limit

threshold of the AP1212 allows a minimum current of 0.5A

through the MOSFET switches. A current limit condition will

signal the error flag.

USB applications support dynamic attachment (hot plug-in)

of peripherals. A current surge is caused by the input capacitance

of downstream device. Ferrite beads are recommended in series

with all power and ground connector pins. Ferrite beads reduce

EMI and limit the inrush current during hot-attachment by filtering

high-frequency signals.

Thermal Shutdown

Short Circuit Transient

When the chip temperature exceeds 140ºC for any reason

other than over current fault of either one of the two MOSFET

switches, the thermal shutdown function turns off both MOSFET

switches and signals the error flag. A hysteresis of 10ºC prevents

the MOSFETs from turning back on until the chip temperature

drops to below 130ºC.

Bulk capacitance provides the short-term transient current

needed during a hot-attachment event. With a 33µF, 16V

tantalum or 100µF, 10V electrolytic capacitor mounted close to

downstream connector per port should provide transient drop

protection.

Printed Circuit Layout

The power circuitry of USB printed circuit boards requires

a customized layout to maximize thermal dissipation and to

minimize voltage drop and EMI.

AP1212 Rev. 2

10 of 12

www.diodes.com

FEBRUARY 2007

1...7 8 91011 12

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