AMMP-6430-TR2G

更新时间： 2024-01-11 10:56:09

品牌	Logo	应用领域
安华高科 - AVAGO		放大器功率放大器
页数	文件大小	规格书
11页	900K
描述
27-32 GHz 0.5W Power Amplifier in SMT Package

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数据手册

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AMMP-6430-TR2G 数据手册

Manual Assembly

•ꢀ Follow ESD precautions while handling packages.

•ꢀ Handling should be along the edges with tweezers.

A properly designed solder screen or stencil is required

to ensure optimum amount of solder paste is deposited

onto the PCB pads. The recommended stencil layout is

shown in Figure 15b. The stencil has a solder paste depo-

sition opening approximately 70% to 90% of the PCB pad.

Reducing stencil opening can potentially generate more

voids underneath. On the other hand, stencil openings

larger than 100% will lead to excessive solder paste smear

or bridging across the I/O pads. Considering the fact that

solder paste thickness will directly aﬀect the quality of

the solder joint, a good choice is to use a laser cut stencil

composed of 0.127mm (5 mils) thick stainless steel which

is capable of producing the required ﬁne stencil outline.

•ꢀ Recommended attachment is conductive solder

paste. Please see recommended solder reﬂow proﬁle.

Neither Conductive epoxy or hand soldering is

recommended.

•ꢀ Apply solder paste using a stencil printer or dot

placement. The volume of solder paste will be

dependent on PCB and component layout and should

be controlled to ensure consistent mechanical and

electrical performance.

•ꢀ Follow solder paste and vendor’s recommendations

when developing a solder reﬂow proﬁle. A standard

proﬁle will have a steady ramp up from room

temperature to the pre-heat temp. to avoid damage

due to thermal shock.

The most commonly used solder reﬂow method is ac-

complished in a belt furnace using convection heat

transfer. The suggested reﬂow proﬁle for automated

reﬂow processes is shown in Figure 16. This proﬁle is

designed to ensure reliable ﬁnished joints. However, the

proﬁle indicated in Figure 1 will vary among diﬀerent

solder pastes from diﬀerent manufacturers and is shown

here for reference only.

•ꢀ Packages have been qualiﬁed to withstand a peak

temperature of 260°C for 20 seconds. Verify that the

proﬁle will not expose device beyond these limits.

300

Peak = 250 5ꢀC

250

AMMP-6430 Part Number Ordering Information

Devices Per

Melting point = 218ꢀC

200

150

100

Part Number

Container

Antistatic bag

7”Reel

AMMP-6430-BLKG

AMMP-6430-TR1G

AMMP-6430-TR2G

100

Ramp 1 Preheat Ramp 2 Reꢁow

Cooling

250

500

7”Reel

100

150

200

300

Seconds

Figure 16. Suggested Lead-Free Reﬂow Proﬁle for SnAgCu Solder Paste

1...6 7 8910 11

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