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AMD29F010B-70JC PDF预览

AMD29F010B-70JC

更新时间: 2024-10-27 21:55:55
品牌 Logo 应用领域
超微 - AMD /
页数 文件大小 规格书
34页 752K
描述
1 Megabit (128 K x 8-bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory

AMD29F010B-70JC 数据手册

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Am29F010B  
1 Megabit (128 K x 8-bit)  
CMOS 5.0 Volt-only, Uniform Sector Flash Memory  
DISTINCTIVE CHARACTERISTICS  
Single power supply operation  
Embedded Algorithms  
— 5.0 V ± 10% for read, erase, and program operations  
— Simplifies system-level power requirements  
— Embedded Erase algorithm automatically  
pre-programs and erases the chip or any  
combination of designated sector  
Manufactured on 0.32 µm process technology  
— Embedded Program algorithm automatically  
programs and verifies data at specified address  
— Compatible with Am29F010 and Am29F010A  
device  
Erase Suspend/Resume  
High performance  
— Supports reading data from a sector not  
being erased  
— 45 ns maximum access time  
Low power consumption  
Minimum 1 million erase cycles guaranteed per  
— 12 mA typical active read current  
— 30 mA typical program/erase current  
— <1 µA typical standby current  
sector  
20-year data retention at 125°C  
— Reliable operation for the life of the system  
Package options  
Flexible sector architecture  
— Eight 16 Kbyte sectors  
— 32-pin PLCC  
— 32-pin TSOP  
— Any combination of sectors can be erased  
— Supports full chip erase  
— 32-pin PDIP  
Compatible with JEDEC standards  
Sector protection  
— Pinout and software compatible with  
single-power-supply flash  
— Hardware-based feature that disables/re-  
enables program and erase operations in any  
combination of sectors  
— Superior inadvertent write protection  
— Sector protection/unprotection can be  
implemented using standard PROM  
programming equipment  
Data# Polling and Toggle Bits  
— Provides a software method of detecting  
program or erase cycle completion  
Publication# 22336 Rev: C Amendment/0  
Issue Date: November 28, 2000  
This Data Sheet states AMD’s current technical specifications regarding the Product described herein. This Data  
Sheet may be revised by subsequent versions or modifications due to changes in technical specifications.  

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