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AMC131M03QDFMRQ1 PDF预览

AMC131M03QDFMRQ1

更新时间: 2024-10-29 14:58:43
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
18页 918K
描述
汽车级三通道、同步采样、24 位、64ksps 隔离式 Δ-Σ ADC | DFM | 20 | -40 to 125

AMC131M03QDFMRQ1 数据手册

 浏览型号AMC131M03QDFMRQ1的Datasheet PDF文件第1页浏览型号AMC131M03QDFMRQ1的Datasheet PDF文件第3页浏览型号AMC131M03QDFMRQ1的Datasheet PDF文件第4页浏览型号AMC131M03QDFMRQ1的Datasheet PDF文件第5页浏览型号AMC131M03QDFMRQ1的Datasheet PDF文件第6页浏览型号AMC131M03QDFMRQ1的Datasheet PDF文件第7页 
ABSOLUTE MAXIMUM RATINGS(1)  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Supply Voltage .................................................................................... +7V  
Signal Input Terminals, Voltage(2) ........................... 0.5V to (V+) + 0.5V  
Current(2) .................................................. ±10mA  
Output Short-Circuit(3) .............................................................. Continuous  
Operating Temperature ..................................................55°C to +150°C  
Storage Temperature .....................................................55°C to +150°C  
Junction Temperature .................................................................... +150°C  
Lead Temperature (soldering, 10s) ............................................... +300°C  
ESD Rating (Human Body Model) .................................................. 2000V  
This integrated circuit can be damaged by ESD. Texas Instru-  
ments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling  
and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation  
to complete device failure. Precision integrated circuits may be  
more susceptible to damage because very small parametric  
changes could cause the device not to meet its published  
specifications.  
NOTE: (1) Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods  
may degrade device reliability. These are stress ratings only,  
and functional operation of the device at these or any other  
conditions beyond those specified is not implied.  
(2) Input terminals are diode-clamped to the power-supply rails. In  
put signals that can swing more than 0.5V beyond the supply  
rails should be current limited to 10mA or less.  
(3) Short-circuit to ground.  
PACKAGE/ORDERING INFORMATION  
For the most current package and ordering information, see  
the Package Option Addendum located at the end of this  
data sheet.  
PIN CONFIGURATIONS  
Top View  
TLV3011AIDBV  
TLV3012AIDBV  
OUT  
V−  
1
2
3
6
5
4
V+  
OUT  
V−  
1
2
3
6
5
4
V+  
REF  
IN−  
REF  
IN−  
IN+  
IN+  
SOT23-6  
SOT23-6  
TLV3011AIDCK  
TLV3012AIDCK  
OUT  
V−  
1
2
3
6
5
4
V+  
OUT  
1
2
3
6
5
4
V+  
REF  
V  
REF  
IN+  
IN−  
IN+  
IN−  
SC70-6  
SC70-6  
NOTE: Pin 1 is determined by orienting package marking as shown.  
TLV3011, TLV3012  
2
www.ti.com  
SBOS300B  

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