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AM75DL9608HGB75IS

更新时间： 2024-11-09 03:11:47

品牌	Logo	应用领域
飞索 - SPANSION		闪存
页数	文件大小	规格书
70页	1107K
描述
64 Megabit (4 M x 16-Bit) and 32 Megabit (2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories, and

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AM75DL9608HGB75IS 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	BGA	包装说明：	LFBGA,
针数：	73	Reach Compliance Code：	compliant
HTS代码：	8542.32.00.71	风险等级：	5.92
其他特性：	PSEUDO STATIC RAM IS ORGANIZED AS 512K X 16; CONTAINS ADDITIONAL 2M X 16 FLASH	JESD-30 代码：	R-PBGA-B73
JESD-609代码：	e0	长度：	11.6 mm
内存密度：	67108864 bit	内存集成电路类型：	MEMORY CIRCUIT
内存宽度：	16	湿度敏感等级：	3
功能数量：	1	端子数量：	73
字数：	4194304 words	字数代码：	4000000
工作模式：	ASYNCHRONOUS	最高工作温度：	85 °C
最低工作温度：	-40 °C	组织：	4MX16
封装主体材料：	PLASTIC/EPOXY	封装代码：	LFBGA
封装形状：	RECTANGULAR	封装形式：	GRID ARRAY, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）：	240	认证状态：	Not Qualified
座面最大高度：	1.4 mm	最大供电电压 (Vsup)：	3.3 V
最小供电电压 (Vsup)：	2.7 V	标称供电电压 (Vsup)：	3 V
表面贴装：	YES	技术：	CMOS
温度等级：	INDUSTRIAL	端子面层：	TIN LEAD
端子形式：	BALL	端子节距：	0.8 mm
端子位置：	BOTTOM	处于峰值回流温度下的最长时间：	30
宽度：	8 mm	Base Number Matches：	1

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Am75DL9608HG

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number 30772 Revision A Amendment +1 Issue Date November 17, 2003

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与AM75DL9608HGB75IS相关器件

型号	品牌	获取价格	描述	数据表
AM75DL9608HGB75IT	SPANSION	获取价格	64 Megabit (4 M x 16-Bit) and 32 Megabit (2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous O
AM75DL9608HGT70FS	SPANSION	获取价格	Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73
AM75DL9608HGT70FT	SPANSION	获取价格	Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73
AM75DL9608HGT70IS	SPANSION	获取价格	64 Megabit (4 M x 16-Bit) and 32 Megabit (2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous O
AM75DL9608HGT70IT	SPANSION	获取价格	64 Megabit (4 M x 16-Bit) and 32 Megabit (2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous O
AM75DL9608HGT75FS	SPANSION	获取价格	Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73
AM75DL9608HGT75FT	SPANSION	获取价格	Memory Circuit, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, FBGA-73
AM75DL9608HGT75IS	SPANSION	获取价格	64 Megabit (4 M x 16-Bit) and 32 Megabit (2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous O
AM75DL9608HGT75IT	SPANSION	获取价格	64 Megabit (4 M x 16-Bit) and 32 Megabit (2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous O
AM75HB-11005S-UZ	AIMTEC	获取价格	Analog Circuit,

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