生命周期: | Active | 包装说明: | FBGA, BGA89,10X10,32 |
Reach Compliance Code: | compliant | 风险等级: | 5.69 |
最长访问时间: | 50 ns | JESD-30 代码: | S-PBGA-B89 |
内存集成电路类型: | MEMORY CIRCUIT | 混合内存类型: | FLASH+PSRAM |
端子数量: | 89 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | FBGA | 封装等效代码: | BGA89,10X10,32 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, FINE PITCH |
电源: | 1.8 V | 认证状态: | Not Qualified |
最大待机电流: | 0.00001 A | 子类别: | Other Memory ICs |
最大压摆率: | 0.06 mA | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
AM49DL3208G | ETC |
获取价格 |
Am49DL3208G - Stacked Multi-Chip Package (MCP) Flash Memory and pSRAM |
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AM49DL3208GB70FS | SPANSION |
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Memory Circuit, 2MX16, CMOS, PBGA69, 8 X 10 MM, FBGA-69 |
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AM49DL3208GB70FT | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA69, 8 X 10 MM, FBGA-69 |
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AM49DL3208GB70IS | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA69, 8 X 10 MM, FBGA-69 |
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AM49DL3208GB70IT | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA69, 8 X 10 MM, FBGA-69 |
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AM49DL3208GB71FS | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA69, 8 X 10 MM, FBGA-69 |
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AM49DL3208GB71FT | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA69, 8 X 10 MM, FBGA-69 |
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AM49DL3208GB71IS | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA69, 8 X 10 MM, FBGA-69 |
![]() |
AM49DL3208GB71IT | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA69, 8 X 10 MM, FBGA-69 |
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AM49DL3208GT70FS | SPANSION |
获取价格 |
Memory Circuit, 2MX16, CMOS, PBGA69, 8 X 10 MM, FBGA-69 |
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