Datasheet > AM3359

AM3359

更新时间： 2022-10-09 15:53:52

品牌	Logo	应用领域
德州仪器 - TI		微处理器
页数	文件大小	规格书
162页	1837K
描述
AM335x ARM Cortex-A8 Microprocessors (MPUs)

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

AM3359 数据手册

AM3359, AM3358, AM3357

AM3356, AM3354, AM3352

SPRS717 –OCTOBER 2011

www.ti.com

7 Mechanical Packaging and Orderable Information

7.1 Thermal Data for ZCE and ZCZ Packages

Table 7-1 provides thermal characteristics for the packages used on this device.

NOTE

Table 7-1 provides simulation data and may not represent actual use-case values.

Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZCE and ZCZ]

NAME

DESCRIPTION

AIR

ZCE

ZCZ

FLOW⁽¹⁾

(°C/W)⁽²⁾

Θ_JC

Θ_JB

Θ_JA

Junction-to-case (1S0P)⁽³⁾

Junction-to-board (2S2P)⁽³⁾

Junction-to-free air (2S2P)⁽³⁾

N/A

0.0

1.0

2.0

3.0

0.0

1.0

2.0

3.0

0.0

1.0

2.0

3.0

10.3

11.6

24.7

20.5

19.7

19.2

0.4

10.2

12.1

24.2

20.1

19.3

18.8

0.3

Ψ_JT

Junction-to-package top (2S2P)⁽³⁾

Junction-to-board (2S2P)⁽³⁾

0.6

0.7

0.9

0.8

Ψ_JB

11.9

11.7

11.6

12.7

12.3

12.2

(1) m/s = meters per second.

(2) °C/W = degress celsius per watt.

(3) The board types are defined by JEDEC (reference JEDEC standard JESD51-9, Test Board for Area

Array Surface Mount Package Thermal Measurements).

7.2 Via Channel

The ZCE package has been specially engineered with Via Channel™ technology. This allows larger than

normal PCB via and trace sizes and reduced PCB signal layers to be used in a PCB design with the

0.65-mm pitch package, and substantially reduces PCB costs. It allows PCB routing in only two signal

layers (four layers total) due to the increased layer efficiency of the Via Channel™ BGA technology.

7.3 Packaging Information

The following packaging information and addendum reflect the most current data available for the

designated device(s). This data is subject to change without notice and without revision of this document.

The figures below show the package drawings for the ZCE and ZCZ package options.

158

Mechanical Packaging and Orderable Information

Submit Documentation Feedback

www.ti.com: AM3359 AM3358 AM3357 AM3356 AM3354 AM3352

1...155 156 157158159 160 161 162

下载PDF

与AM3359相关器件

型号	品牌	描述	获取价格	数据表
AM3359_12	TI	AM335x ARM? Cortex?-A8 Microprocessors (MPUs)	获取价格
AM3359_1211	TI	AM335x ARMÂ® Cortexâ¢-A8 Microprocessors (MP	获取价格
AM3359_13	TI	Sitaraâ¢ AM335x ARMÂ® Cortexâ¢-A8 Microproc	获取价格
AM3359_14	TI	Sitara AM335x ARM Cortex-A8 Microprocessors (MPUs)	获取价格
AM3359BZCZA80	TI	Sitara 处理器：Arm Cortex-A8、EtherCAT、3D、PRU-ICSS	获取价格
AM3359ZCZD72	TI	AM335x ARMÂ® Cortexâ¢-A8 Microprocessors (MP	获取价格