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AM29PL320DB90WPI PDF预览

AM29PL320DB90WPI

更新时间: 2024-12-01 20:00:23
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路闪存
页数 文件大小 规格书
49页 943K
描述
Flash, 1MX32, 90ns, PBGA84, 11 X 12 MM, 0.80 MM PITCH, FBGA-84

AM29PL320DB90WPI 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:BGA
包装说明:11 X 12 MM, 0.80 MM PITCH, FBGA-84针数:84
Reach Compliance Code:not_compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.86
Is Samacsys:N最长访问时间:90 ns
备用内存宽度:16启动块:BOTTOM
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:R-PBGA-B84
JESD-609代码:e0长度:12 mm
内存密度:33554432 bit内存集成电路类型:FLASH
内存宽度:32湿度敏感等级:3
功能数量:1部门数/规模:1,2,1,15
端子数量:84字数:1048576 words
字数代码:1000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX32封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA84,9X10,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
页面大小:4/8 words并行/串行:PARALLEL
峰值回流温度(摄氏度):240电源:3/3.3 V
编程电压:3 V认证状态:Not Qualified
座面最大高度:1.2 mm部门规模:16K,8K,96K,128K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.08 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
切换位:YES类型:NOR TYPE
宽度:11 mmBase Number Matches:1

AM29PL320DB90WPI 数据手册

 浏览型号AM29PL320DB90WPI的Datasheet PDF文件第2页浏览型号AM29PL320DB90WPI的Datasheet PDF文件第3页浏览型号AM29PL320DB90WPI的Datasheet PDF文件第4页浏览型号AM29PL320DB90WPI的Datasheet PDF文件第5页浏览型号AM29PL320DB90WPI的Datasheet PDF文件第6页浏览型号AM29PL320DB90WPI的Datasheet PDF文件第7页 
Am29PL320D  
Data Sheet  
RETIRED  
PRODUCT  
This product has been retired and is not recommended for designs. For new and current designs,  
S29GL032M supersedes Am29PL320D and is the factory-recommended migration path. Please refer  
to the S29GL032M datasheet for specifications and ordering information. Availability of this docu-  
ment is retained for reference and historical purposes only.  
June 2005  
The following document specifies Spansion memory products that are now offered by both Advanced  
Micro Devices and Fujitsu. Although the document is marked with the name of the company that  
originally developed the specification, these products will be offered to customers of both AMD and  
Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a Spansion product. Any  
changes that have been made are the result of normal datasheet improvement and are noted in the  
document revision summary, where supported. Future routine revisions will occur when appro-  
priate, and changes will be noted in a revision summary.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about Spansion  
memory solutions.  
Publication Number 24075 Revision C Amendment +3 Issue Date June 13, 2005  

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