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AM29PL320DB60RWPI PDF预览

AM29PL320DB60RWPI

更新时间: 2024-11-30 04:10:31
品牌 Logo 应用领域
超微 - AMD 闪存内存集成电路
页数 文件大小 规格书
49页 946K
描述
32 Megabit (2 M x 16-Bit/1 M x 32-Bit) CMOS 3.0 Volt-only High Performance Page Mode Flash Memory

AM29PL320DB60RWPI 技术参数

是否Rohs认证:不符合生命周期:Transferred
零件包装代码:BGA包装说明:11 X 12 MM, 0.80 MM PITCH, FBGA-84
针数:84Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.57Is Samacsys:N
最长访问时间:60 ns备用内存宽度:16
启动块:BOTTOM命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:S-PBGA-B84JESD-609代码:e0
长度:12 mm内存密度:33554432 bit
内存集成电路类型:FLASH内存宽度:32
湿度敏感等级:3功能数量:1
部门数/规模:1,2,1,15端子数量:84
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:1MX32
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA84,9X10,32封装形状:SQUARE
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH页面大小:4/8 words
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V编程电压:3 V
认证状态:Not Qualified座面最大高度:1.2 mm
部门规模:16K,8K,96K,128K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.08 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED切换位:YES
类型:NOR TYPE宽度:11 mm
Base Number Matches:1

AM29PL320DB60RWPI 数据手册

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Am29PL320D  
Data Sheet  
RETIRED  
PRODUCT  
This product has been retired and is not recommended for designs. For new and current designs,  
S29GL032M supersedes Am29PL320D and is the factory-recommended migration path. Please refer  
to the S29GL032M datasheet for specifications and ordering information. Availability of this docu-  
ment is retained for reference and historical purposes only.  
June 2005  
The following document specifies Spansion memory products that are now offered by both Advanced  
Micro Devices and Fujitsu. Although the document is marked with the name of the company that  
originally developed the specification, these products will be offered to customers of both AMD and  
Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a Spansion product. Any  
changes that have been made are the result of normal datasheet improvement and are noted in the  
document revision summary, where supported. Future routine revisions will occur when appro-  
priate, and changes will be noted in a revision summary.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about Spansion  
memory solutions.  
Publication Number 24075 Revision C Amendment +3 Issue Date June 13, 2005  

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