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AM29LV160BB-90WCD PDF预览

AM29LV160BB-90WCD

更新时间: 2024-11-06 05:33:51
品牌 Logo 应用领域
超微 - AMD 闪存内存集成电路
页数 文件大小 规格书
54页 1329K
描述
16 Megabit (2 M x 8-Bit/1 M x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory

AM29LV160BB-90WCD 技术参数

是否Rohs认证: 符合生命周期:Transferred
包装说明:FBGA, BGA48,6X8,32Reach Compliance Code:unknown
风险等级:5.78最长访问时间:90 ns
备用内存宽度:8启动块:BOTTOM
命令用户界面:YES通用闪存接口:YES
数据轮询:YESJESD-30 代码:R-PBGA-B48
内存密度:16777216 bit内存集成电路类型:FLASH
内存宽度:16部门数/规模:1,2,1,31
端子数量:48字数:1048576 words
字数代码:1000000最高工作温度:70 °C
最低工作温度:组织:1MX16
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA48,6X8,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH并行/串行:PARALLEL
电源:3/3.3 V认证状态:Not Qualified
就绪/忙碌:YES部门规模:16K,8K,32K,64K
最大待机电流:0.000005 A子类别:Flash Memories
最大压摆率:0.03 mA表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM切换位:YES
类型:NOR TYPEBase Number Matches:1

AM29LV160BB-90WCD 数据手册

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Am29LV160B  
Data Sheet  
RETIRED  
PRODUCT  
This product has been retired and is not recommended for designs. For new and current designs,  
S29AL016D supersedes Am29LV160B and is the factory-recommended migration path. Please refer to  
the S29AL016D datasheet for specifications and ordering information. Availability of this document is  
retained for reference and historical purposes only.  
June 2005  
The following document specifies Spansion memory products that are now offered by both Advanced  
Micro Devices and Fujitsu. Although the document is marked with the name of the company that  
originally developed the specification, these products will be offered to customers of both AMD and  
Fujitsu.  
Continuity of Specifications  
There is no change to this datasheet as a result of offering the device as a Spansion product. Any  
changes that have been made are the result of normal datasheet improvement and are noted in the  
document revision summary, where supported. Future routine revisions will occur when appro-  
priate, and changes will be noted in a revision summary.  
For More Information  
Please contact your local AMD or Fujitsu sales office for additional information about Spansion  
memory solutions.  
Publication Number 21358 Revision H Amendment 4 Issue Date June 6, 2005  

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