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AM29LV065GU103RWHE PDF预览

AM29LV065GU103RWHE

更新时间: 2024-09-20 19:58:15
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路闪存
页数 文件大小 规格书
52页 793K
描述
Flash, 8MX8, 100ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, FBGA-63

AM29LV065GU103RWHE 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:11 X 12 MM, 0.80 MM PITCH, FBGA-63
针数:63Reach Compliance Code:compliant
ECCN代码:3A001.A.2.CHTS代码:8542.32.00.51
风险等级:5.46最长访问时间:100 ns
JESD-30 代码:R-PBGA-B63JESD-609代码:e0
长度:12 mm内存密度:67108864 bit
内存集成电路类型:FLASH内存宽度:8
湿度敏感等级:3功能数量:1
端子数量:63字数:8388608 words
字数代码:8000000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:8MX8封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):240编程电压:3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子面层:TIN LEAD端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30类型:NOR TYPE
宽度:11 mmBase Number Matches:1

AM29LV065GU103RWHE 数据手册

 浏览型号AM29LV065GU103RWHE的Datasheet PDF文件第2页浏览型号AM29LV065GU103RWHE的Datasheet PDF文件第3页浏览型号AM29LV065GU103RWHE的Datasheet PDF文件第4页浏览型号AM29LV065GU103RWHE的Datasheet PDF文件第5页浏览型号AM29LV065GU103RWHE的Datasheet PDF文件第6页浏览型号AM29LV065GU103RWHE的Datasheet PDF文件第7页 
ADVANCE INFORMATION  
Am29LV065GU  
64 Megabit (8 M x 8-Bit) CMOS 3.0 Volt-only  
Uniform Sector Flash Memory with VersatileI/O Control  
DISTINCTIVE CHARACTERISTICS  
Minimum 1 million erase cycle guarantee per sector  
ARCHITECTURAL ADVANTAGES  
Single power supply operation  
20-year data retention at 125°C  
— 2.7 to 3.6 volt read, erase, and program operations  
— Reliable operation for the life of the system  
VersatileI/O control  
SOFTWARE FEATURES  
— Device generates data output voltages and tolerates  
data input voltages as determined by the voltage on  
the VIO pin  
CFI (Common Flash Interface) compliant  
— Allows host system to accommodate different Flash  
devices by providing device-specific information  
SecSi (Secured Silicon) Sector region  
Erase Suspend/Erase Resume  
— 256-byte sector for permanent, secure identification  
through an 16-byte random Electronic Serial Number  
— Read/program other sectors before an erase  
operation is complete  
— May be programmed and locked at the factory or by  
the customer  
Program Suspend/Program Resume  
— Accessible through a command sequence  
— Read other sectors before an program operation is  
complete  
Compatibility with JEDEC standards  
— Pinout and software compatible with  
single-power-supply Flash standard  
Data# Polling and toggle bits  
— Indicates program or erase operation completion  
Manufactured on 0.17 µm process technology  
Unlock Bypass Program command  
— Reduces overall programming time when issuing  
multiple program command sequences  
Flexible sector architecture  
— One hundred twenty-eight 64 Kbyte sectors  
Package options  
HARDWARE FEATURES  
— 48-pin Standard and Reverse TSOP  
— 63-ball FBGA  
Sector Protection  
— A hardware method to lock a sector to prevent  
program or erase operations within that sector  
PERFORMANCE CHARACTERISTICS  
— Sectors can be locked in-system or via programming  
equipment  
High performance  
— Access time ratings as fast as 70 ns  
Temporary Sector Unprotect feature allows code  
changes in previously locked sectors  
Program and Erase Performance (VHH not applied to  
the ACC input)  
Ready/Busy# input (RY/BY#)  
— Sector erase time: 0.6 s typical for each 64 Kbyte  
sector  
— Indicates program or erase cycle completion  
Hardware reset input (RESET#)  
Ultra low power consumption (typical values at 3.0 V,  
— Resets the device for a new operation  
5 MHz)  
ACC input  
— 9 mA typical active read current  
— 26 mA typical erase/program current  
— 200 nA typical standby mode current  
— Accelerates programming time for higher throughput  
during system production  
Publication# 25288  
Issue Date: August 28, 2002  
Rev: A Amendment/1  
This Data Sheet states AMD’s current technical specifications regarding the Products described herein. This Data Sheet may be revised by subsequent versions or modifications  
due to changes in technical specifications.This document contains information on a product under developement at Advanced Micro Devices. The information is intended to help  
you evaluate this product. Do not design in this product without contacting the factory. AMD reserves the right to change or discontinue work on this proposed product without  
notice.  
Refer to AMD’s Website (www.amd.com) for the latest information.  

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