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AM29LV065DU101RWHF PDF预览

AM29LV065DU101RWHF

更新时间: 2024-11-08 20:33:11
品牌 Logo 应用领域
飞索 - SPANSION 内存集成电路闪存
页数 文件大小 规格书
53页 1047K
描述
Flash, 8MX8, 100ns, PBGA63, 11 X 12 MM, 0.80 MM PITCH, LEAD FREE, FBGA-63

AM29LV065DU101RWHF 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:BGA包装说明:TFBGA, BGA63,8X12,32
针数:63Reach Compliance Code:compliant
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.46Is Samacsys:N
最长访问时间:100 ns命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B63JESD-609代码:e1
长度:12 mm内存密度:67108864 bit
内存集成电路类型:FLASH内存宽度:8
湿度敏感等级:3功能数量:1
部门数/规模:128端子数量:63
字数:8388608 words字数代码:8000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:8MX8
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装等效代码:BGA63,8X12,32封装形状:RECTANGULAR
封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH并行/串行:PARALLEL
峰值回流温度(摄氏度):260电源:3.3,1.8/2.9 V
编程电压:3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.03 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40切换位:YES
类型:NOR TYPE宽度:11 mm
Base Number Matches:1

AM29LV065DU101RWHF 数据手册

 浏览型号AM29LV065DU101RWHF的Datasheet PDF文件第2页浏览型号AM29LV065DU101RWHF的Datasheet PDF文件第3页浏览型号AM29LV065DU101RWHF的Datasheet PDF文件第4页浏览型号AM29LV065DU101RWHF的Datasheet PDF文件第5页浏览型号AM29LV065DU101RWHF的Datasheet PDF文件第6页浏览型号AM29LV065DU101RWHF的Datasheet PDF文件第7页 
Am29LV065D  
Data Sheet (Retired Product)  
Am29LV065D Cover Sheet  
This product has been retired and is not recommended for designs. For new and current designs, S29GL064N supercedes  
Am29LV065D. This is the factory-recommended migration path. Please refer to the S29GL-N data sheet for specifications and  
ordering information. Availability of this document is retained for reference and historical purposes only.  
The following document contains information on Spansion memory products.  
Continuity of Specifications  
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been  
made are the result of normal data sheet improvement and are noted in the document revision summary.  
For More Information  
Please contact your local sales office for additional information about Spansion memory solutions.  
Publication Number 23544  
Revision C  
Amendment 3  
Issue Date February 26, 2009  

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